Nickel monosilicide

Nickel monosilicide is an intermetallic compound formed out of nickel and silicon. Like other nickel silicides, NiSi is of importance in the area of microelectronics.

NiSi
Identifiers
3D model (JSmol)
Properties
NiSi
Molar mass 86.778 g/mol
Structure[1]
Orthorhombic, oP8
Pnma, No. 62
a = 0.519 nm, b = 0.333 nm, c = 0.5628 nm
4
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
Infobox references

Preparation

Nickel monosilicide can be prepared by depositing a nickel layer on silicon and subsequent annealing. In the case of Ni films with thicknesses above 4 nm, the normal phase transition is given by Ni2Si at 250 °C followed by NiSi at 350 °C and NiSi2 at approximately 800 °C.[2]

For ultra-thin nickel films, with thicknesses below 4 nm, nickel monosilicide is formed at lower annealing temperatures of 230 °C - 290 °C.[3]

Uses

Several properties make NiSi an important local contact material in the area of microelectronics, among them a reduced thermal budget, low resistivity of 13-14 μΩ·cm and a reduced Si consumption when compared to alternative compounds.[4]

References
  1. Wopersnow W., Schubert K. (1976) Z. Metallkd., 67, 807–810
  2. d'Heurle, F. M.; Gas, P. (February 1986). "Kinetics of formation of silicides: A review". Journal of Materials Research. 1 (1): 205–221. doi:10.1557/JMR.1986.0205. ISSN 2044-5326. Archived from the original on 2020-10-17. Retrieved 2020-10-16.
  3. Tran, Tuan T.; Lavoie, Christian; Zhang, Zhen; Primetzhofer, Daniel (January 2021). "In-situ nanoscale characterization of composition and structure during formation of ultrathin nickel silicide". Applied Surface Science. 536: 147781. doi:10.1016/j.apsusc.2020.147781. S2CID 219981123. Archived from the original on 2020-10-17. Retrieved 2020-10-16.
  4. Lavoie, C.; d’Heurle, F.M.; Detavernier, C.; Cabral, C. (November 2003). "Towards implementation of a nickel silicide process for CMOS technologies". Microelectronic Engineering. 70 (2–4): 144–157. doi:10.1016/S0167-9317(03)00380-0. Archived from the original on 2018-07-03. Retrieved 2020-10-16.


This article is issued from Wikipedia. The text is licensed under Creative Commons - Attribution - Sharealike. Additional terms may apply for the media files.