LGA 3647

LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200 ("Knights Landing"),[2] Xeon Phi 72x5 ("Knights Mill"), Skylake-SP, Cascade Lake-SP/AP, and Cascade Lake-W microprocessors.[3]

LGA 3647
TypeLGA
Chip form factorsFlip-chip land grid array (FCLGA)
Contacts3647
FSB protocol
Processor dimensions76.0 mm × 56.5 mm
Processors
Predecessor
Memory supportDDR4

This article is part of the CPU socket series

The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for QPI, and 100G Omni-Path interconnect and also has a new mounting mechanism which does not use a lever to secure it in place but the CPU cooler’s pressure and its screws to secure it in place

Variants

There are two sub-versions of this socket with differences in the ILM (Independent Loading Mechanism), and the processor package carrier frame (square, and narrow) preventing mounting the other version's heatsink.

References

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