United Microelectronics Corporation

United Microelectronics Corporation (UMC; Chinese: 聯華電子; pinyin: Liánhuá Diànzǐ) is a Taiwanese company based in Hsinchu, Taiwan. It was founded as Taiwan's first semiconductor company in 1980 as a spin-off of the government-sponsored Industrial Technology Research Institute (ITRI).[1]

United Microelectronics Corporation
聯華電子
TypePublic
TWSE: 2303
NYSE: UMC
IndustrySemiconductor Foundry
Founded1980 (1980)
HeadquartersHsinchu Science Park
Hsinchu, Taiwan
Key people
Stan Hung, Chairman
SC Chien, Co-president
Jason Wang, Co-president
RevenueUS$5 billion (2019)
Number of employees
19,500
Websitewww.umc.com
The Singapore factory and offices of United Microelectronics Corporation.

UMC is best known for its semiconductor foundry business, manufacturing integrated circuits wafers for fabless semiconductor companies. In this role, UMC is ranked behind competitors TSMC and GlobalFoundries.[2] It has four 300 mm fabs, one in Taiwan, one in Singapore, one in China, and one in Japan.[1]

UMC is listed on the Taiwan Stock Exchange as 2303. UMC has 12 manufacturing facilities worldwide, employing approximately 19,500 people.

History

  • On May 22, 1980, UMC was spun off from the Industrial Technology Research Institute and was formally established as the first private integrated circuit company in Taiwan, Republic of China.
  • 1985: UMC was officially listed on the Taiwan Stock Exchange (code: 2303). It was the first listed semiconductor company in Taiwan. At that time, Morris Chang ever was its chairman.
  • 1995: UMC decided to transform from an IDM company with its own products to a professional pure-play foundry.
  • 1996: Spun off its IC design units to establish MediaTek, Novatek, ITE Technology, Faraday Technology, AMIC Technology, and Davicom.
  • 1999: Fab 12A 12-inch wafer fab in Tainan Science Park was officially established.
  • 2000:
    • Lists on the New York Stock Exchange (code: UMC) as Taiwan's first semiconductor company to do so.[3]
    • Produces the first chips using copper process technology and the first 0.13 micron ICs in the semiconductor industry.
  • 2004: 12-inch wafer fab in Singapore enters mass production.
  • 2008: Listed as a constituent stock on the Dow Jones Sustainability Index (DJSI) for the first time.[4]
  • 2010: 30th anniversary of the company.
  • 2013: Fully acquires "Hejian Technology Wafer Fab" in Suzhou, Mainland China.
  • 2015: USCXM 12-inch wafer fab located in Xiamen, Fujian Province, China was officially established. [5]
  • 2017: 28nm mass production begins at USCXM in Xiamen, Mainland China.
  • 2019: Fully acquired Japan-based Mie Fujitsu Semiconductor. [6][7][8]
  • 2020: Reached a plea agreement with the U.S. Department of Justice to resolve a 2018 trade secrets case.[9]

Fab list[10]

FabNodeLocationWafer diameterWafers per month
WKT 450-350 nmHsinchu, Taiwan150 mm31,000
Fab 8AB500-250 nmHsinchu, Taiwan200 mm67,000
Fab 8C350-110 nmHsinchu, Taiwan200 mm37,000
Fab 8D130-90 nmHsinchu, Taiwan200 mm31,000
Fab 8E500-180 nmHsinchu, Taiwan200 mm37,000
Fab 8F180-150 nmHsinchu, Taiwan200 mm40,000
Fab 8S180-110 nmHsinchu, Taiwan200 mm31,000
Fab 8N (He Jian)500-110 nmSuzhou, China200 mm76,000
Fab 12A130-14 nmTainan, Taiwan300 mm87,000
Fab 12i130-40 nmSingapore300 mm53,000
Fab 12X (United Semiconductor)40-28 nmXiamen, China300 mm19,000 -> 25,000 (2021)
Fab 12M (USJC, former Fujitsu) 90-40 nm Mie, Japan 300 mm 33,000

See also

References

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