List of semiconductor fabrication plants

This is a list of semiconductor fabrication plants. A semiconductor fabrication plant is where integrated circuits (ICs), also known as microchips, are manufactured. They are either operated by Integrated Device Manufacturers (IDMs) who design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by Pure Play foundries, that manufacture designs from fabless companies and do not design their own ICs. Some Pure Play foundries like TSMC offer IC design services, and others, like Samsung, design and manufacture ICs for customers, while also designing, manufacturing and selling their own ICs.

This list is incomplete; you can help by adding missing items with reliable sources.

Glossary of terms
  • Wafer Size – largest wafer size that a facility is capable of processing
  • Process Technology Node – size of the smallest features that the facility is capable of etching onto the wafers
  • Production Capacity – a manufacturing facility's nameplate capacity. Generally max wafers produced per month
  • Utilization – the number of wafers that a manufacturing plant processes in relation to its production capacity
  • Technology/Products – Type of product that the facility is capable of producing, as not all plants can produce all products on the market

Open plants

Operating fabs include:

Company Plant Name Plant Location Plant Cost (in US$ billions) Started Production Wafer Size (mm) Process Technology Node (nm) Production Capacity (Wafers/Month) Technology / Products
UMC - He Jian Fab 8N China 0.750,[1] 1.2, +0.5 2003, May[1] 200 4000–1000, 500, 350, 250, 180, 110 77,000 Foundry
UMC Fab 6A Taiwan , Hsinchu 0.35[1] 1989[1] 150 450 31,000 Foundry
UMC Fab 8AB Taiwan , Hsinchu 1[1] 1995[1] 200 250 67,000[2] Foundry
UMC Fab 8C Taiwan , Hsinchu 1[1] 1998[1] 200 350–110 37,000 Foundry
UMC Fab 8D Taiwan , Hsinchu 1.5[1] 2000[1] 200 90 31,000 Foundry
UMC Fab 8E Taiwan , Hsinchu 0.96[1] 1998[1] 200 180 37,000 Foundry
UMC Fab 8F Taiwan , Hsinchu 1.5[1] 2000[1] 200 150 40,000 Foundry
UMC Fab 8S Taiwan , Hsinchu 0.8[1] 2004[1] 200 350–250 31,000 Foundry
UMC Fab 12A Taiwan , Tainan 4.65, 4.1, 6.6, 7.3[1] 2001, 2010, 2014, 2017[1] 300 28, 14 87,000[2] Foundry
UMC Fab 12i Singapore 3.7[1] 2004[1] 300 130–40 53,000 Foundry
UMC - United Semiconductor Fab 12X China , Xiamen 6.2 2016 300 55–28 19,000-25,000 (2021) Foundry
UMC - USJC (formerly MIFS) (formerly Fujitsu) Fab 12M (original Fujitsu installations)[3] Japan , Mie 1974 150, 200, 300[4] 90–40 33,000 Foundry
Texas Instruments FFAB Germany , Freising 200 1000–180
Texas Instruments (formerly National Semiconductor) MFAB[5] USA , ME, South Portland .932 1997 200 350, 250, 180
Texas Instruments RFAB USA , TX, Richardson 2009 300 180, 130 BiCMOS
Texas Instruments DMOS6 USA , TX, Dallas 300 130–65, 45
Texas Instruments DMOS5 USA , TX, Dallas 200 180 BiCMOS
Texas Instruments DFAB USA , TX, Dallas 1964 150/200 1000–500
Texas Instruments SFAB USA , TX, Sherman 150 2000–1000
Texas Instruments MIHO8 Japan, Miho 200 350–250 BiCMOS
Texas Instruments (formerly Spansion) Aizu Japan, Aizu 200 110
Texas Instruments (formerly SMIC - Cension) Chengdu (CFAB) China , Chengdu 200
Tsinghua Unigroup[6] China , Nanjing 10 (first phase), 30 Planned 300 100,000 (first phase) 3D NAND Flash
Tsinghua Unigroup[6] China , Chengdu 28 Planned 300 500,000 Foundry
Tsinghua Unigroup - XMC (formerly Xinxin)[7] Fab 1 China , Wuhan[1] 1.9 2008 300 90, 65, 60, 50, 45, 40, 32 30,000[8] Foundry, NOR
Tsinghua Unigroup - Yangtze Memory Technologies (YMTC) - XMC (formerly Xinxin)[7][8][6] Fab 2 China , Wuhan 24 2018[1] 300 20 200,000 3D NAND
SMIC S1 Mega Fab (S1A/S1B/S1C)[9] China , Shanghai 200 350–90 114,000[10] Foundry
SMIC S2 (Fab 8)[9] China , Shanghai 300 45/40–32/28 20,000[10] Foundry
SMIC - SMSC SN1[9] China , Shanghai 10 (expected) (planned) 300 12 / 14 70,000[7] Foundry
SMIC B1 Mega Fab (Fab 4, Fab 6)[9] China , Beijing 2004 300 180–90/55 50,000[10] Foundry
SMIC B2A[9] China , Beijing 3.59[11] 2014 300 45/40–32/28 35,000[10] Foundry
SMIC Fab 7[9] China , Tianjin 2004 200 350–90 50,000[10] Foundry
SMIC Fab 15[9] China , Shenzhen 2014 200 350–90 50,000[10] Foundry
SMIC SZ (Fab 16A/B)[9] China , Shenzhen 2019 300 8 / 14 40,000[7] Foundry
SMIC[7] B3 China , Beijing 7.6 Under construction 300 35,000 Foundry
Wuxi Xichanweixin (formerly SMIC - LFoundry) (formerly LFoundry) (formerly Micron)[12] (formerly Texas Instruments) LF Italy , Avezzano 1995 200 180–90 50,000
Nanya Fab Taiwan , ? 199x 300 DRAM
Nanya Fab 2 Taiwan , Linkou 0.8 2000 200[13] 175 30,000 DRAM
Nanya Fab 3A[14] Taiwan , New Taipei City[15] 1.85[16] 2018 300 20 DRAM
Micron Fab 1 USA , VA, Manassas 1981 300 DRAM
Micron (formerly IM Flash) Fab 2 IMFT USA , UT, Lehi 300 25[17] 70,000 DRAM, 3D XPoint
Micron Fab 4[18] USA , ID, Boise 300 RnD
Micron (formerly Dominion Semiconductor) Fab 6 USA , VA, Manassas 1997 300 25[17] 70,000 DRAM, NAND FLASH, NOR
Micron (formerly TECH Semiconductor) Fab 7 (formerly TECH Semiconductor, Singapore)[19] Singapore , Singapore 300 60,000 NAND FLASH
Micron (formerly IM Flash)[20] Fab 10[21] Singapore , Singapore 3 2011 300 25 100,000 NAND FLASH
Micron (formerly Inotera) Fab 11[22] Taiwan , Taoyuan 300 20 and under 80,000 DRAM
Micron Fab 13[23] Singapore , Singapore 200 NOR
Micron Singapore [24] 200 NOR Flash
Micron Micron Semiconductor Asia Singapore [24]
Micron China , Xi'an[24]
Micron (formerly Elpida Memory) Fab 15 (formerly Elpida Memory, Hiroshima)[18][24] Japan, Hiroshima 300 20 and under 100,000 DRAM
Micron (formerly Rexchip) Fab 16 (formerly Rexchip, Taichung)[18] Taiwan , Taichung 300 30 and under 80,000 DRAM, FEOL
Micron (formerly Cando) Micron Memory Taiwan[24] Taiwan , Taichung ?, 2018 300 DRAM, BEOL
Micron A3 Taiwan , Taichung[25] Under construction 300 DRAM
Intel D1B USA , OR, Hillsboro 1996 300 10 / 14 / 22 Microprocessors[26]
Intel D1C[27][26] USA , OR, Hillsboro 2001 300 10 / 14 / 22 Microprocessors[26]
Intel D1D[27][26] USA , OR, Hillsboro 2003 300 7 / 10 / 14 Microprocessors[26]
Intel D1X[28][26] USA , OR, Hillsboro 2013 300 7 / 10 / 14 Microprocessors[26]
Intel Fab 12[27][26] USA , AZ, Chandler 1996 300 14 / 22 / 65 Microprocessors & chipsets[26]
Intel Fab 32[27][29] USA , AZ, Chandler 3 2007 300 45
Intel Fab 32[27][26] USA , AZ, Chandler 2007 300 22 / 32 Microprocessors[26]
Intel Fab 42[30][31][26] USA , AZ, Chandler 10[32] 2020[33] 300 7 / 10 Microprocessors[26]
Intel Fab 11x[27][26] USA , NM, Rio Rancho 2002 300 32 / 45 Microprocessors[26]
Intel (formerly Micron) (formerly Numonyx) (formerly Intel) Fab 18[34] Israel , Kiryat Gat 1996 200, 300 45 / 65 / 90 / 180 Microprocessors and chipsets,[35] NOR flash
Intel Fab 10[27] Ireland , Leixlip 1994 200
Intel Fab 14[27] Ireland , Leixlip 1998 200
Intel Fab 24[27][26] Ireland , Leixlip 2004 300 14 / 65 / 90[36] Microprocessors, Chipsets and Comms[26]
Intel Fab 28[27][26] Israel , Kiryat Gat 2008 300 10 / 22 / 45 Microprocessors[26]
Intel Fab 68[27][37] China , Dalian 2.5 2010 300 65[38] 30,000–52,000 Microprocessors (former), VNAND[26]
Intel Costa Rica , Heredia, Belén 1997 300 14 / 22 Packaging
General Motors Components Holdings Fab III USA , IN, Kokomo 125/200 500+
Raytheon Systems Ltd UK, Glenrothes, Scotland 1960 100 CMOS-on-SiC, foundry
BAE Systems (formerly Sanders) USA , NH, Nashua[1] 1985[1] 100, 150 140, 100, 70, 50 MMIC, GaAs, GaN-on-SiC, foundry
Flir Systems USA , CA, Santa Barbara[39] 150 IR Detectors, Thermal Imaging Sensors
Qorvo (formerly RF Micro Devices) USA , NC, Greensboro[40] 100,150 500 8,000 SAW filters, GaAs HBT, GaAs pHEMT, GaN
Qorvo (formerly TriQuint Semiconductor) (formerly Micron) (formerly Texas Instruments) (formerly TwinStar Semiconductor) USA , TX, Richardson[40] 0.5 1996 100, 150, 200 350, 250, 150, 90 8,000 DRAM (former), BAW filters, power amps, GaAs pHEMT, GaN-on-SiC
Qorvo (formerly TriQuint Semiconductor) USA , OR, Hillsboro[40] 100, 150 500 Power amps, GaAs
Apple (formerly Maxim) (formerly Samsung) X3[41] USA , CA, San Jose ?, 1997, 2015[42] 600–90
Analog Devices Limerick Ireland , Limerick 200
Analog Devices Wilmington USA , MA, Wilmington 200/150
Analog Devices (formerly Linear Technology) Hillview USA , CA, Milipitas 150
Analog Devices (formerly Linear Technology) Camas USA , WA, Camas 150
Maxim MaxFabNorth[43] USA , OR, Beaverton
ISRO SCL [44] India , Chandigarh 2006 200 180 MEMS, CMOS, CCD, N.S.
STAR-C[45] [46] MEMS[47] India , Bangalore 1996 150 1000–500 MEMS
STAR-C[48] [49] CMOS[50] India , Bangalore 1996 150 1000–500 CMOS
GAETEC[51] [52] GaAs[53] India , Hyderabad 1996 150 700–500 MESFET
Tower Semiconductor (formerly Maxim) Fab 9[54][55] USA , TX, San Antonio 2003 200 180 Foundry, Al BEOL, Power, RF Analog
Tower Semiconductor (formerly National Semiconductor) Fab 1[56] Israel , Migdal Haemek 0.235[1] 1989, 1986[1] 150 1000–350 14,000 Foundry, Planarized BEOL, W and Oxide CMP, CMOS, CIS, Power, Power Discrete
Tower Semiconductor Fab 2[56] Israel , Migdal Haemek 1.226[1] 2003 200 180–130 51,000[1] Foundry, Cu and Al BEOL, EPI, 193 nm Scanner, CMOS, CIS, Power, Power Discrete, MEMS, RFCMOS
Tower Semiconductor (formerly Jazz Technologies) (formerly Conexant) (formerly Rockwell) Fab 3,[56] Newport Beach[1] USA , CA, Newport Beach 0.165[1] 1967, 1995[1] 200 130–500 25,000[1] Foundry, Al BEOL, SiGe, EPI
Tower Semiconductor – TPSCo (formerly Panasonic) Fab 5,[56] Tonami[57] Japan, Tonami 1994 200 500–130 Foundry, Analog/Mixed-Signal,Power,Discrete, NVM, CCD
Tower Semiconductor – TPSCo (formerly Panasonic) Fab 7,[56] Uozu[57] Japan, Uozu 1984 300 65. 45 Foundry, CMOS,CIS,RF SOI, Analog/Mixed-Signal
Tower Semiconductor – TPSCo (formerly Panasonic) Fab 6,[56] Arai[57] Japan, Arai 1976 200 130–110 Foundry, Analog/Mixed-Signal,CIS,NVM,Thick Cu RDL
Nuvoton[58] Fab2 Taiwan 150 350–1000 nm 45,000[58] Generic Logic, Mixed Signal (Mixed Mode), High Voltage, Ultra High Voltage, Power Management, Mask ROM (Flat Cell), Embedded Logic, Non-Volatile Memory, IGBT, MOSFET, Biochip, TVS, Sensor
Nuvoton Nuvoton Technology Corporation Taiwan, No. 4, Creation Rd. III, Hsinchu Science Park
Microchip (formerly California Micro Devices) (formerly GTE) Fab 2 USA , AZ, Tempe 130, 150, 200 5000–350
Microchip (formerly Fujitsu) Fab 4 USA , OR, Gresham 2004 200 500–130
Microchip (formerly Atmel) Fab 5 USA , CO, Colorado Springs 150 1000–250
Rohm[59] (formerly Renesas) Shiga Factory Japan 200 150 IGBT, MOSFET, MEMS
Rohm (Lapis Semiconductor)(formerly Oki Semiconductor)(Oki Electric Industry)[59][60] Miyasaki Japan 150 MEMS
Rohm (Lapis Semiconductor)[59] Building No.1 Japan 1961[61] Transistors
Rohm (Lapis Semiconductor)[59] Building No.2 Japan 1962[61] Transistors
Rohm (Lapis Semiconductor)[59] Building No.3 Japan 1962[61] Transistors
Rohm (Lapis Semiconductor)[59] Building No.4 Japan 1969[61] Transistors
Rohm (Lapis Semiconductor)[59] Chichibu Plant Japan 1975[61] DRAM
Rohm (Lapis Semiconductor)[59] VLSI Laboratory No. 1 Japan 1977[61] VLSI
Rohm (Lapis Semiconductor)[59] VLSI Laboratory No. 2 Japan 1983[61]
Rohm (Lapis Semiconductor)[59] VLSI Laboratory No. 3 Japan 1983[61] DRAM
Rohm (Lapis Semiconductor)[59] Oregon Plant USA, OR 1990[61]
Rohm (Lapis Semiconductor)[59] Thailand Thailand 1992[61]
Rohm (Lapis Semiconductor)[59] ULSI Laboratory No. 1 Japan 1992[61] 500 DRAM
Rohm (Kionix)[62] Ithaca USA, NY, Ithaca 150 MEMS
Rohm (Kionix)[62] (formerly Renesas Kyoto) Kyoto Japan, Kyoto 200 MEMS
Oki Electric Industry[63] Japan , Tokyo, Minato-ku 1961 100, 150, 130, 76 7,200 Bipolar, Mask ROM
Oki Electric Industry[63] Miyazaki Oki Electric Co 1981 100, 150, 130, 76 3000 7,200 Bipolar, Mask ROM, DRAM[61]
Oki Electric Industry[63] Miyagi Facility 1988[61] 100, 150, 130, 76 7,200 Bipolar, Mask ROM
Oki Electric Industry[63] Hachioji Facility 100, 150, 130, 76 7,200 Bipolar, Mask ROM
Oki Electric Industry[64] 150 180–150 SoCs, LSI, Logic, Memory
Fuji Electric[65] Omachi Japan, Nagano Prefecture
Fuji Electric[66] Iyama Japan, Nagano Prefecture
Fuji Electric[67] Hokuriku Japan, Toyama prefecture
Fuji Electric[68] Matsumoto Japan, Nagano prefecture
Fujitsu Kawasaki Japan , Kawasaki 1966[69]
Fujitsu[70][71] Fab B1 (at Mie)[72] Japan, 1500 Tadocho Mizono, Kuwana, Mie[73] 2005 300 65, 90 15,000 Foundry, Ultra-low Power ICs, Embedded Memory, RF ICs
Fujitsu[70][71] Fab B2 (at Mie)[72] Japan, 1500 Tadocho Mizono, Kuwana, Mie[73] 1 (total)[74] 2007, July 300 65, 90 25,000 Foundry, Ultra-low Power ICs, Embedded Memory, RF ICs[75]
Fujitsu[70][71] Japan, 1500 Tadocho Mizono, Kuwana, Mie[73] 2015 300 40[76] 5,000 Foundry
Fujitsu Kumagaya Plant[72] Japan, Saitama, 1224 Oaza-Nakanara, Kumagaya-shi, 360-0801 1974
Fujitsu[77] Suzaka Plant Japan, Nagano, 460 Oaza-Koyama, Suzaka-shi, 382-8501
Fujitsu Iwate Plant[78][4] Japan, Iwate, 4-2 Nishinemoriyama, Kanegasaki-cho, Isawa-gun, 029-4593
Denso (formerly Fujitsu)[79] Denso Iwate[80][81][82] Japan , Iwate Prefecture, Kanegasaki-cho 0.088 Under construction, 2019, May (planned) Semiconductor wafers and sensors (since June 2017)
Canon Inc. Oita[83] Japan
Canon Inc. Kanagawa[84] Japan
Canon Inc. Ayase[83] Japan
Sharp Corporation Fukuyama[85] Japan
Japan Semiconductor

[86]

 Iwate Japan
Japan Semiconductor[86] Oita Japan
Kioxia Yokkaichi Operations[87][88] Japan, Yokkaichi 1992 173,334[89][90][91][92] Flash Memory
Kioxia/SanDisk Fab 5 Phase 1 (at Yokkaichi Operations) Japan, 800 Yamanoisshikicho, Yokkaichi, Mie[93] 2011 Flash
Kioxia/SanDisk Fab 5 Phase 2[93] (at Yokkaichi Operations) Japan, Mie 2011 300 15[94] Flash
Kioxia[95] Fab 3 (at Yokkaichi Operations) Japan, Yokkaichi NAND Memory
Kioxia[96] Fab 4 (at Yokkaichi Operations) Japan, Yokkaichi 2007 NAND Memory
Kioxia[97] Kaga Toshiba Japan, Ishikawa Power semiconductor devices
Kioxia[98] Oita Operations Japan, Kyushu
Kioxia[99][100] Fab 6 (phase 1) (at Yokkaichi Operations)[101] Japan, Yokkaichi 1.6, 1.7, 1.8 (estimates) (combined costs of installation of equipment at Phase 1 and construction of Phase 2)[102][88] 2018 BiCS FLASH™
Kioxia[99][100] Fab 6 (phase 2) (at Yokkaichi Operations) Japan, Yokkaichi 1.6, 1.7, 1.8 (estimates) (combined costs of installation of equipment at Phase 1 and construction of Phase 2)[102][88] Planned BiCS FLASH™
Kioxia[99][100] Japan, Yokkaichi 4.6[103][104] Planned BiCS FLASH™
Kioxia[99] Fab 2 (at Yokkaichi Operations) Japan, Yokkaichi 1995 3D NAND
Kioxia[105][106] New Fab 2 (at Yokkaichi Operations) Japan, Yokkaichi 2016, July 15 3D NAND
Kioxia[107][108][109][110] Japan, Iwate Prefecture Under Construction 3D NAND
Western Digital[111][112]
Hitachi[113] Rinkai Factory Japan, 5-2-2, Omikacho, Hitachi-shi, Ibaraki, 319-1221 MEMS Foundry
Hitachi[113] Haramachi Factory Japan, 20 Aza Oohara, Shimo-Ota, Haramachi-ku, Minamisouma-shi, Fukushima, 975-0041 Power semiconductors
Hitachi[113] Yamanashi Factory Japan, 545, Itchohata, Chuo-shi, Yamanashi, 409-3813 Power semiconductors
ABB[114] Lenzburg Switzerland, Lenzburg 0.140 2010 (second phase) 130, 150 18,750 (225,000 per year) High power semiconductors, diodes, IGBT, BiMOS
ABB[114] Czech Republic
Mitsubishi Electric[115] Power Device Works, Kunamoto Site Japan Power semiconductors
Mitsubishi Electric[115] Power Device Works, Fukuoka Site Japan , Kunamoto Prefecture, Fukuoka City[116] Power semiconductors and sensors[116]
Mitsubishi Electric[117] High frequency optical device manufacturing plant Japan , Hyogo Prefecture[117] High frequency semiconductor devices (GaAsFET, GaN, MMIC)[117]
Powerchip Semiconductor Memory Foundry, Fab P1[118][119] Taiwan , Hsinchu 2.24[1] 2002[1] 300 90, 70, 22[120] 80,000 Foundry, Memory IC, LCD drive IC, Integrated Memory Chips, CMOS Image Sensors, and Power Management IC
Powerchip Semiconductor Fab P2[119] Taiwan , Hsinchu, Hsinchu Science Park 1.86[1] 2005[1] 300 90, 70, 22[120] 80,000 Foundry, Memory IC, LCD drive IC, Integrated Memory Chips, CMOS Image Sensors, and Power Management IC
Powerchip Semiconductor Fab P3[119] Taiwan , Hsinchu, Hsinchu Science Park 300 90, 70, 22[120] 20,000 Foundry, Memory IC, LCD drive IC, Integrated Memory Chips, CMOS Image Sensors, and Power Management IC
Renesas[121] Naka Factory 751, Horiguchi, Hitachinaka-shi, Ibaraki, 312-8504, Japan 2009 300 28[122]
Renesas (formerly Trecenti) Japan [123][124] 300 180, 90, 65 Foundry
Renesas[121] Takasaki Factory 111, Nishiyokotemachi, Takasaki-shi, Gunma, 370-0021, Japan
Renesas[121] Shiga Factory 2-9-1, Seiran, Otsu-shi, Shiga, 520-8555, Japan
Renesas[121] Yamaguchi Factory 20192-3, Higashimagura Jinga, Ube-shi, Yamaguchi, 757-0298, Japan
Renesas[121] Kawashiri Factory 1-1-1, Yahata, Minami-ku, Kumamoto-shi, Kumamoto, 861-4195, Japan
Renesas[121] Saijo Factory 8-6, Hiuchi, Saijo-shi, Ehime, 793-8501, Japan
Renesas[121] Musashi Site 5-20-1, Josuihon-cho, Kodaira-shi, Tokyo, 187-8588, Japan
Renesas (formerly NEC Electronics) (formerly NEC) Roseville[125][126] USA , CA, Roseville 1.2[127] 2002, April 200 RAM, SoCs, Multimedia Chips
Renesas-Intersil[121] 1 Murphy Ranch Rd USA , CA, Milpitas
Integrated Device Technology USA , OR, Hillsboro 1997 200 140–100[128]
NEC[63] 100, 130, 150 SRAM, DRAM
NEC[129] Japan DRAM
TSI Semiconductors[130] (formerly Renesas) Roseville fab, M-Line, TD-Line, K-Line[131][1] USA , CA, Roseville 1992, 1985[1] 200
TDK - Micronas FREIBURG[132][133] Germany, Freiburg, 19 D-79108, Hans-Bunte-Strasse
TDK (formerly Renesas) Tsuruoka Higashi[134][135] 125[136]
TDK Japan , Saku[137]
TDK - Tronics USA , TX, Addison[138]
Silanna (formerly Sapphicon Semiconductor) Australia, Sydney Olympic Park[1] 0.030 1965,1989[1] 150
Silanna (formerly Sapphicon Semiconductor) (formerly Peregrine Semiconductor) (formerly Integrated Device Technology) Australia, Sydney

[139]

 150 500, 250 RF CMOS, SOS, foundry
Murata Manufacturing[140] Nagano[136] Japan 0.100 SAW filters[136]
Murata Manufacturing[140] Otsuki[136] Japan
Murata Manufacturing[140] Kanazawa Japan 0.111 SAW filters[136]
Murata Manufacturing (formerly Fujifilm)[141][142] Sendai Japan, Miyagi Prefecture 0.092[136] MEMS[143]
Murata Manufacturing[141] Yamanashi Japan, Yamanashi Prefecture
Murata Manufacturing[144] Yasu Japan, Yasu, Shiga Prefecture
Mitsumi Electric[145] Semiconductor Works #3 Japan, Atsugi Operation Base 2000
Mitsumi Electric[145] Japan, Atsugi Operation Base 1979
Sony[146] Kagoshima Technology Center Japan, Kagoshima 1973 Bipolar CCD, MOS, MMIC, SXRD
Sony[146] Oita Technology Center Japan, Oita 2016 CMOS Image Sensor
Sony[146] Nagasaki Technology Center Japan, Nagasaki 1987 MOS LSI, CMOS Image Sensors, SXRD
Sony[146] Kumamoto Technology Center Japan, Kumamoto 2001 CCD Imgage Sensors, H-LCD, SXRD
Sony[146] Shiroishi Zao Technology Center Japan, Shiroishi 1969 Semiconductor Lasers
Sony Sony Shiroishi Semiconductor Inc. Japan, Miyagi Semiconductor Lasers[147]
Sony (formerly Renesas) (formerly NEC Electronics) (formerly NEC)[146][148][149] Yamagata Technology Center Japan, Yamagata 2014 CMOS Image Sensor, eDRAM (formerly)
MagnaChip F-5[150] 2005 200 130
SK Hynix[151] China , Chongqing
SK Hynix[151] China , Chongqing
SK Hynix[152][153] South Korea , Cheongju, Chungcheongbuk-do Under construction[154] NAND Flash
SK Hynix[153] South Korea , Cheongju Under construction NAND Flash
SK Hynix M8 South Korea , Cheongju 200 Foundry
SK Hynix M10 South Korea , Icheon 300 DRAM
SK Hynix M11 South Korea , Cheongju 300 NAND Flash
SK Hynix M12 South Korea , Cheongju 300 NAND Flash
SK Hynix HC1 China , Wuxi 300 100,000[7] DRAM
SK Hynix HC2 China , Wuxi 300 70,000[7] DRAM
SK Hynix M14 South Korea , Icheon 300 DRAM, NAND Flash
SK Hynix[153] M16 South Korea , Incheon 3.13 (13.4 total planned) 2021 (planned) 300 10 (EUV) 15,000-20,000 (initial) DRAM
LG Innotek[155] Paju South Korea , 570, Hyuam-ro, Munsan-eup, Paju-si, Gyeonggi-do, 10842 LED Epi-wafer, Chip, Package
Diodes Incorporated[156] (formerly Zetex Semiconductors) OFAB UK, Oldham 150
Diodes Incorporated (formerly BCD Semi)[157] China 150 4000–1000
Diodes Incorporated (formerly Texas Instruments) GFAB UK, Scotland, Greenock 150/200 40,000
Lite-On Optoelectronics[158] China, Tianjin
Lite-On Optoelectronics[158] Thailand, Bangkok
Lite-On Optoelectronics[158] China, Jiangsu
Lite-On Semiconductor[159] Keelung Plant Taiwan, Keelung 1990 100 Thyristor, DIscrete
Lite-On Semiconductor[159] Hsinchu Plant Taiwan, Hsinchu 2005 Bipolar BCD, CMOS
Lite-On Semiconductor[159] Lite-On Semi (Wuxi) China, Jiangsu 2004 100 Discrete
Lite-On Semiconductor[159] Wuxi WMEC Plant China, Jiangsu 2005 Discrete, Power, Optical ICs
Lite-On Semiconductor[159] Shanghai (SSEC) Plant China, Shanghai 1993 76 Fab, Assembly
Trumpf[160] (formerly Philips Photonics) Germany , Ulm VCSEL
Philips[161] Netherlands, Eindhoven 200,150 30,000 R&D, MEMS
Nexperia (formerly NXP Semiconductors) (formerly Philips) Hamburg site[162] Germany , Hamburg 1953 200 35,000 Small-signal and bipolar discrete devices
Nexperia (formerly NXP Semiconductors) (formerly Philips) (formerly Mullard) Manchester[162] UK, Bramhall Moor Lane, Pepper Rd, Hazel Grove, Stockport SK7 5BJ 1987? 150, 200 24,000 GaN FETs, TrenchMOS MOSFETs
NXP Semiconductors (formerly Philips) ICN8 Netherlands, Nijmegen 200 40,000+[163] SiGe
NXP Semiconductors Japan [63] Bipolar, Mos, Analog, Digital, Transistors, Diodes
NXP Semiconductors - SSMC SSMC Singapore 1.7[1] 2001[1] 200 120 53,000 SiGe
NXP Semiconductors - Jilin Semiconductor China , Jilin 130
NXP Semiconductors (formerly Freescale Semiconductor) (formerly Motorola) Oak Hill Fab[164] USA , TX, Austin .8[165] 1991 200 250
NXP Semiconductors (formerly Freescale Semiconductor) (formerly Motorola) Chandler Fab[166] USA , AZ, Chandler[167] 1.1[168] +0.1 (GaN) 1993 150 (GaN), 200 180 GaN-on-SiC pHEMT
NXP Semiconductors (formerly Freescale Semiconductor) (formerly Motorola) ATMC[169] USA , TX, Austin 1995 200 90
NXP Semiconductors (formerly Freescale Semiconductor) (formerly Motorola) MOTOFAB1[170] Mexico , Guadalajara 2002
AWSC Taiwan , Tainan[1] 1999[1] 150 12,000 Foundry, GaAs HBT, D pHEMT, IPD, ED pHEMT, ED BiHEMT, InGaP
Skyworks Solutions[171] (formerly Conexant) (formerly Rockwell) USA, CA 100, 150 Compound Semiconductors (GaAs, AlGaAs, InGaP)
Skyworks Solutions[171] (formerly Alpha Industries) USA, MA, Woburn 100, 150 RF/cellular components (SiGe, GaAs)
Skyworks Solutions[171] Japan, Osaka SAW, TC-SAW Filters
Skyworks Solutions[171] Japan, Kadoma SAW, TC-SAW Filters
Skyworks Solutions[171] Singapore, Bedok South Road SAW, TC-SAW Filters
Win Semiconductor Fab A[172] Taiwan , Taoyuan City 150[173] 2000–10 Foundry, GaAs
Win Semiconductor Fab B[172] Taiwan , Taoyuan City 150[173] 2000–10 Foundry, GaAs, GaN
Win Semiconductor Fab C Taiwan , Taoyuan[1] 0.050, 0.178 2000, 2009[1] 150 Foundry, GaAs
ON Semiconductor (formerly Motorola) ISMF Malaysia, Seremban 150 350 80,000 Discrete
ON Semiconductor (formerly LSI) Gresham[174] USA, OR, Gresham 200 110
ON Semiconductor (formerly TESLA) Roznov Czech Republic, Roznov 150 5000
ON Semiconductor (formerly AMI Semiconductor) Pocatello[175] USA , ID, Pocatello 200 350
ON Semiconductor (formerly AMI Semiconductor) (formerly Alcatel Microelectronics) (formerly Mietec) Oudenaarde Belgium, Oudenaarde 150 350 4,000
ON Semiconductor (formerly Sanyo)[176][177] Niigata Japan, Niigata 130, 150 350
ON Semiconductor (formerly Fairchild Semiconductor) (formerly National Semiconductor) (formerly Fairchild Semiconductor) USA , PA, Mountain Top 1960/1997 200 350
ON Semiconductor (formerly Fairchild Semiconductor) (formerly National Semiconductor) (formerly Fairchild Semiconductor) USA , ME, South Portland 1960/1997 200 350
ON Semiconductor (formerly Fujitsu)[178][179] Aizu Wakamatsu Plant[180] Japan, Fukushima, 3 Kogyo Danchi, Monden-machi, Aizuwakamatsu-shi, 965-8502 1970[69] 150, 200[181][182][183][184] Memory, Logic
ams[185] FAB B Austria, Unterpremstaetten 200 350
Osram (Osram Opto Semiconductors) Malaysia, Kulim, Kulim Hi-Tech Park 0.350, 1.18[186] 2017, 2020 (second phase, planned)[187][188] 150 LEDs
Osram (Osram Opto Semiconductors) Malaysia, Penang[189][190] 2009 100 LEDs
Osram (Osram Opto Semiconductors) Germany , Regensburg[191] 2003, 2005 (second phase)[192] LEDs
Winbond Memory Product Foundry[193] Taiwan , Taichung 300 46
Winbond CTSP Site[194][195] Taiwan, No. 8, Keya 1st Rd.,Daya Dist.,Central Taiwan Science Park, Taichung City 42881 300
Winbond[196] Planned 300
Vanguard International Semiconductor Fab 1 Taiwan , Hsinchu 0.997[1] 1994[1] 200 55,000 Foundry
Vanguard International Semiconductor (formerly Winbond) Fab 2 (formerly Fab 4&5)[197] Taiwan , Hsinchu 0.965[1] 1998[1] 200 55,000 Foundry
Vanguard International Semiconductor Corporation (formerly GlobalFoundries) (formerly Chartered) Fab 3E[198] Singapore 1.3[1] 200 180 34,000 Foundry
TSMC Fab 2[199] Taiwan , Hsinchu 0.735[1] 1990[1] 150 88,000[200][1] Foundry
TSMC Fab 3 Taiwan , Hsinchu 2[1] 1995[1] 200 100,000[1] Foundry
TSMC Fab 5 Taiwan , Hsinchu 1.4[1] 1997[1] 200 48,000[1] Foundry
TSMC Fab 6 Taiwan , Tainan 2.1[1] 2000, January; 2001[123] 200, 300 180–? 99,000[1] Foundry
TSMC (formerly TASMC) (formerly Acer Semiconductor Manufacturing Inc.) (formerly Texas Instruments)[201][202][203] Fab 7[204] Taiwan 200 350, 250, 220, 180 33,000 Foundry (current)

DRAM (former), Logic (former)

TSMC (formerly WSMC) Fab 8 Taiwan , Hsinchu 1.6[1] 1998[1] 200 250, 180 85,000[1] Foundry
TSMC (formerly WSMC)[124] 2000 200 250, 150 30,000 Foundry
TSMC Fab 10 China , Shanghai 1.3[1] 2004[1] 200 74,000 Foundry
TSMC WaferTech Fab 11 USA , WA, Camas 1.2 1998 200 350, 250, 180, 160 33,000 Foundry
TSMC Fab 12 Taiwan , Hsinchu 5.2, 21.6 (total, all phases combined)[1] 2001[1] 300 150–28 77,500–123,800 (all phases combined)[1] Foundry
TSMC Fab 12A Taiwan , Hsinchu 300 25,000 Foundry
TSMC Fab 12B Taiwan , Hsinchu 300 25,000 Foundry
TSMC Fab 12 (P4) Taiwan , Hsinchu 6[1] 2009[1] 300 20 40,000[1] Foundry
TSMC Fab 12 (P5) Taiwan , Hsinchu 3.6[1] 2011[1] 300 20 6,800[1] Foundry
TSMC Fab 12 (P6) Taiwan , Hsinchu 4.2[1] 2013[1] 300 16 25,000 Foundry
TSMC Fab 12 (P7) Taiwan , Hsinchu (future) 300 16 Foundry
TSMC Fab 12 (P8)[1] Taiwan , Chunan[1] 5.1[1] 2017[1] 450[1] Foundry
TSMC Fab 14 Taiwan , Tainan 5.1[1] 2002,[123] 2004[1] 300 20 82,500[1] Foundry
TSMC Fab 14 (B) Taiwan , Tainan 300 16 50,000+[205] Foundry
TSMC Fab 14 (P3)[1] Taiwan , Tainan 3.1[1] 2008[1] 300 16 55,000[1] Foundry
TSMC Fab 14 (P4)[1] Taiwan , Tainan 3.750[1] 2011[1] 300 16 45,500[1] Foundry
TSMC Fab 14 (P5)[1] Taiwan , Tainan 3.650[1] 2013[1] 300 16 Foundry
TSMC Fab 14 (P7)[1] Taiwan , Tainan 4.850[1] 2015[1] 300 16 Foundry
TSMC Fab 14 (P6)[1] Taiwan , Tainan 4.2[1] 2014[1] 300 16 Foundry
TSMC Fab 15[206] Taiwan , Taichung 9.3 2011 300 20 100,000+(166,000 estimate)[207][205][208] Foundry
TSMC Fab 15 (B) Taiwan , Taichung 300 Foundry
TSMC Fab 15 (P1)[1] Taiwan , Taichung 3.125[1] 2011 300 4,000[1] Foundry
TSMC Fab 15 (P2)[1] Taiwan , Taichung 3.150[1] 2012[1] 300 Foundry
TSMC Fab 15 (P3)[1] Taiwan , Taichung 3.750[1] 2013[1] 300 Foundry
TSMC Fab 15 (P4)[1] Taiwan , Taichung 3.800[1] 2014[1] 300 Foundry
TSMC Fab 15 (P5)[1] Taiwan , Taichung 9.020[1] 2016[1] 300 35,000 Foundry
TSMC Fab 18 Taiwan , Southern Taiwan Science Park[209][210] 17.08 2020 (planned), under construction 300 5[211] 120,000 Foundry
TSMC[7] NJ Fab 16 China , Nanjing 2018 300 20,000 Foundry
TSMC[7][212][213] Taiwan , Tainan Science Park[214] 20 (expected)[215] Future 3[216][217] Foundry
TSMC 20[218] 2022 (planned)[219] 3 Foundry
Epistar Fab F1[220] Taiwan , Longtan Science Park LEDs
Epistar Fab A1[220] Taiwan , Hsinchu Science Park LEDs
Epistar Fab N2[220] Taiwan , Hsinchu Science Park LEDs
Epistar Fab N8[220] Taiwan , Hsinchu Science Park LEDs
Epistar Fab N1[220] Taiwan , Hsinchu Science Park LEDs
Epistar Fab N3[220] Taiwan , Hsinchu Science Park LEDs
Epistar Fab N6[220] Taiwan , Chunan Science Park LEDs
Epistar Fab N9[220] Taiwan , Chunan Science Park LEDs
Epistar Fab H1[220] Taiwan , Central Taiwan Science Park LEDs
Epistar Fab S1[220] Taiwan , Tainan Science Park LEDs
Epistar Fab S3[220] Taiwan , Tainan Science Park LEDs
Epistar (formerly TSMC)[221][222][223] Taiwan , Hsin-Chu Science Park 0.080 2011, second half LEDs
Lextar T01 Taiwan , Hsinchu Science Park LEDs
GCS USA , CA, Torrance[1] 1999[1] 100 6,400 Foundry, GaAs, InGaAs, InGaP, InP, HBT, PICs
Bosch Germany , Reutlingen 1995[224] 150 ASIC, analog, power, SiC
Bosch Germany , Dresden 1.0[225] under construction 300 65
Bosch WaferFab Germany , Reutlingen 0.708[226] 2010[224] 200 30,000 ASIC, analog, power, MEMS
STMicroelectronics AMK8 (second, newer fab) Singapore , Ang Mo Kio 1995 200
STMicroelectronics (formerly SGS Microelettronica) AMJ9 (first fab) Singapore , Ang Mo Kio 1984[227] 150, 200 6” 14 kpcs/day, 8” 1.4 kpcs/day Power-MOS/ IGBT/ bipolar/ CMOS
STMicroelectronics Crolles 1 / Crolles 200 France , Crolles 1993 200 25,000
STMicroelectronics Crolles2 / Crolles 300 France , Crolles 2003 300 90, 65, 45, 32, 28 20,000 FDSOI
STMicroelectronics Tours France , Tours 200 500 8": 9kpcs/W; 12" 400–1000/W ASIC
STMicroelectronics (formerly SGS-ATES) R2 (upgraded in 2001 from R1) Italy , Agrate Brianza 1963 200
STMicroelectronics (formerly SGS-ATES) AG8/AGM Italy , Agrate Brianza 1963 200
STMicroelectronics Catania Italy , Catania 1997 150 (GaN), 200 GaN
STMicroelectronics Rousset France , Rousset 2000 200
X-Fab Erfurt Germany , Erfurt 1985[1] 200[228] 600–1000[228] 11200–[228] Foundry
X-Fab (formerly ZMD) Dresden Germany , Dresden 0.095[1] 1985[1] 200[229] 350–1000[229] 6000–[229] Foundry, CMOS, GaN-on-Si
X-Fab (formerly Itzehoe) Itzehoe Germany , Itzehoe 200[230] 13000–[230] Foundry, MEMS
X-Fab (formerly 1st Silicon)[231][232] Kuching Malaysia, Kuching 1.89[1] 2000[1] 200[233] 130–350[233] 30,000–[233] Foundry
X-Fab (formerly Texas Instruments) Lubbock USA , TX, Lubbock 0.197[1] 1977[1] 150, 200[234] 600–1000[234] 15000–[234] Foundry, SiC
X-Fab France SAS (formerly Altis Semiconductor) (formerly IBM)[235] ACL-AMF France , Corbeil-Essonnes 1991, 1964[1] 200 130–350 Foundry, CMOS, RF SOI
CEITEC Brazil , Porto Alegre 2010 200 600–1000 RFID
IXYS Germany IGBT[236]
IXYS UK[236]
IXYS USA , MA[236]
IXYS USA , CA[236]
Samsung V1-Line[237] South Korea , Hwaseong 6 2020, February 20 300 7 Microprocessors, Foundry
Samsung S3-Line[238] South Korea , Hwaseong 10.2, 16.2 (planned)[239][240] 300 10 200,000 DRAM, VNAND, Foundry
Samsung S2-Line[241] USA , TX, Austin 16[242][243] 2011 300 65–11 92,000 Microprocessors, FDSOI, Foundry, NAND[244]
Samsung S1-Line[245] South Korea , Giheung 33 (total) 2005 (second phase), 1983 (first phase)[246][247] 300 65–7 62,000 Microprocessors, S.LSI, LEDs, FDSOI, Foundry[248]
Samsung Pyeongtaek[249][250][239] South Korea , Pyeongtaek 14.7, 27 (total)[251][243][252][253][254][255][256][154] 2017, July 6 300 14 450,000[257] V-NAND, DRAM, Foundry
Samsung 6 Line[258] South Korea , Giheung 200 180–65 Foundry
Samsung Samsung China Semiconductor[259] China, Shaanxi Province DDR Memory
Samsung Samsung Suzhou Research Center (SSCR)[245] China , Suzhou, Suzhou Industrial Park DDR Memory
Samsung Onyang Complex[259] South Korea , Chungcheongnam-do DDR Memory, System Logic
Samsung F1x1[260][239] China , Xian 2.3[261] 2014 (first phase, second phase is under review)[239] 300 20 100,000 VNAND
Samsung Giheung Campus[262] South Korea , Gyeonggi-do, Yongin LEDs
Samsung Hwasung Campus[262] South Korea , Gyeonggi-do, Hwaseong LEDs
Samsung Tianjin Samsung LED Co., Ltd.[262] China , Tianjin, Xiqing, Micro-Electronic Industrial Park, Weisi Road LEDs
Seagate USA , MN[263]
Seagate Northern Ireland[264][265][266][267]
Broadcom Limited USA , CO, Fort Collins[268]
Cree Inc.[269] Durham USA, NC, Durham Compound Semiconductors, LEDs
Cree Inc.[270] Research Triangle Park USA, NC GaN HEMT RF ICs
SMART Modular Technologies Brazil , Atibaia 2006 Packaging
NEWPORT WAFER FAB[271] (formerly Infineon Technologies) FAB11 UK, Wales, Newport 200[272] 180–700[272] 32,000[272] Foundry, Compound Semiconductors, IC, MOSFET, IGBT[273]
Changxin Memory Technologies China 7.2 2019 300 19, 17 125,000 DRAM[274]
Infineon Technologies Villach Austria, Villach 1970[275] 100/150/200/300 MEMS, SiC, GaN
Infineon Technologies Dresden Germany , Dresden 3[276] 1994/2011[277] 200/300 90
Infineon Technologies Kulim[278] Malaysia, Kulim 2006[279] 200/300 50,000
Infineon Technologies Kulim 2 Malaysia, Kulim 2015 200/300 50,000
Infineon Technologies Regensburg[280] Germany , Regensburg 1959
Infineon Technologies Cegled[281] Hungary, Cegled
Infineon Technologies Cheonan South Korea , Cheonan-si
Infineon Technologies El Segundo USA , CA, El Segundo[282]
Infineon Technologies Batam Indonesia, Batam
Infineon Technologies Leominster USA
Infineon Technologies Malacca Malaysia
Infineon Technologies Mesa USA
Infineon Technologies Morgan Hill USA
Infineon Technologies Morrisville USA
Infineon Technologies Neubiberg Germany
Infineon Technologies San Jose USA
Infineon Technologies Singapore Singapore
Infineon Technologies Temecula USA
Infineon Technologies Tijuana Mexico
Infineon Technologies Warstein Germany
Infineon Technologies Wuxi China
Infineon Technologies - Cypress Semiconductor Fab25 USA, TX, Austin 1994 200 Flash / Logic
SkyWater Technology (formerly Cypress Semiconductor) (formerly Control Data) (formerly VTC) Minnesota fab USA, MN, Bloomington 1991 200 65, 90, 130, 180, 250, 350 Foundry, SOI, FDSOI, MEMS, SiPh, CNT, 3D packaging, superconducting ICs
D-Wave Systems[283] Superconducting Foundry[284] Quantum Processing Units (QPUs)[284]
GlobalFoundries (formerly AMD) Fab 1 Module 1[285] Germany , Dresden 3.6[1] 2005 300 22–45 35,000[1] Foundry, SOI, FDSOI
GlobalFoundries (formerly AMD) Fab 1 Module 2 Germany , Dresden 4.9[1] 1999 300 22–45 25,000[1] Foundry, SOI
GlobalFoundries Fab 1 Module 3 Germany , Dresden 2.3[1] 2011[1] 300 22–45 6,000[1] Foundry, SOI
GlobalFoundries (formerly Chartered) Fab 2[198] Singapore 1.3[1] 1995[1] 200 350–600 56,000[1] Foundry, SOI
GlobalFoundries (formerly Chartered) Fab 3/5[198] Singapore 0.915, 1.2[1] 1997, 1995[1] 200 180–350 54,000 Foundry, SOI
GlobalFoundries (formerly Chartered) Fab 6[198] (merged into Fab 7) Singapore 1.4[1] 2000[1] 200, 300 (merged) 110–180 45,000 Foundry, SOI
GlobalFoundries (formerly Chartered) Fab 7[285] Singapore 4.6[1] 2005[1] 300 40, 65, 90, 110, 130 50,000 Foundry, Bulk CMOS, RF SOI
GlobalFoundries Fab 8[285] USA , NY, Malta 4.6, 2.1, 13+ (total)[286][287] 2012, 2014[1] 300 12 / 14 / 22 / 28 60,000 Foundry, High-K Metal Gate,[288] SOI FinFET
GlobalFoundries Technology Development Center[1] USA , NY, Malta 1.5[1] 2014[1]
GlobalFoundries (formerly IBM) Fab 9 USA , VT, Essex Junction 200 90–350 40,000 Foundry, SiGe, RF SOI
(future ON Semiconductor) GlobalFoundries (formerly IBM)[289][290][291] Fab 10 USA , NY, East Fishkill 2.5, +.29 (future)[286] 2002 300 90–22, 14 12,000-15,000[286] Foundry, RF SOI, SOI FinFET (former), SiGe, SiPh
SUNY Poly CNSE NanoFab 300 North[292] USA , NY, Albany .175, .050 2004, 2005 300 65, 45, 32, 22
SUNY Poly CNSE NanoFab 200[293] USA , NY, Albany .016 1997 200
SUNY Poly CNSE NanoFab Central[292] USA , NY, Albany .150 2009 300 22
Skorpios Technologies (formerly Novati) (formery ATDF) (formerly SEMATECH) USA , TX, Austin[1][294] 0.065 1989[1] 200 10,000 MEMS, photonics, foundry
Opto Diode USA , CA, Camarillo[295]
Optek Technology[63] 1968 100, 150 GaAs, LEDs
II-VI (formerly Oclaro) (formerly Bookham) (formerly NORTHERN TELECOM SEMICONDUCTOR

NORTHERN TELECOM EUROPE[63]) (formely JDS Uniphase) (formerly Uniphase)

 Semiconductor Lasers, Photodiodes
Infinera USA , CA[296][297]
Rogue Valley Microdevices USA , OR, Medford 2003 150 MEMS foundry
IMT Fab 1 USA, CA, Goleta 2000 150, 200 350 20,000 Foundry: MEMS, Photonics, Sensors, Biochips
Sensera uDev-1 USA, MA, Woburn 2014 150 700 1,000 MEMS, MicroDevice assembly
Rigetti Computing Fab-1[298][299][300] USA , CA, Fremont 130 Quantum Processors
NHanced Semiconductors[301] MNC USA, NC, Morrisville 2001 100, 150, 200 >=500 1000 MEMS, Silicon Sensors, BEoL, 2.5/3D and advanced packaging
Polar Semiconductor[302] FAB1 USA , MN, Bloomington 150 BCD, HV
Polar Semiconductor[302] FAB2 USA , MN, Bloomington 200 BCD, HV, GMR
Noel Technologies[303] 450–51[304][303] 500–250[305]
Orbit Semiconductor[63] 100 CCD, CMOS
Entrepix USA , AZ, Tempe[1] 2003[1]
Medtronic USA , AZ, Tempe[1] 1973[1]
Technologies and Devices International USA , FL, Silver Springs[1] 2002[1]
Soraa Inc USA , CA[306][307]
Soraa Laser Diode[306]
Mirrorcle Technologies USA , CA[308]
Teledyne DALSA Teledyne DALSA Semiconductor Canada, Bromont, QC 1980 150/200 HV ASICs, HV CMOS, MEMS, CCD
HT Micron Brazil , São Leopoldo 2014 DRAM, eMCP, iMCP
Unitec do Brasil Brazil , Ribeirão Neves Planned
Unitec Blue[309] Argentina, Chascomús 0.3 (1.2 planned)[310] 2013 RFID, SIM, EMV
Everlight Yuan-Li Plant Taiwan , Miao-Li LEDs
Everlight Pan-Yu Plant China LEDs
Everlight Tu-Cheng Plant Taiwan , Taipei Country LEDs
Optotech[311] Taiwan , Hsinchu LEDs
Arima Optoelectronics Taiwan , Hsinchu[1] 1999[1]
Episil Semiconductor Taiwan , Hsinchu[1] 1992, 1990, 1988[1]
Episil Semiconductor Taiwan , Hsinchu[1] 1992, 1990, 1988[1]
Creative Sensor Inc.[312][313] NanChang Creative Sensor China, Jiangxi 2007 Image Sensors
Creative Sensor Inc.[312] Wuxi Creative Sensor China, JiangSu 2002
Creative Sensor Inc.[312] Wuxi Creative Sensor Taiwan, Taipei City 1998
Visera Technologies[314] Headquarters Phase I Taiwan, Hsinchu Science-based Industrial Park 2007, September CMOS Image Sensors
Panjit Taiwan , Kaohsiung[1] 0.1 2003[1]
ProMOS Fab 4[315][316] Taiwan , Taichung 1.6 300 70
Macronix[317] Fab 5 300 50,000
Macronix[317] Fab 2 200 48,000
Macronix[317] Fab 1 150 40,000
Nanosystem Fabrication Facility Hong Kong[318]
ASMC[319] FAB 1/2 China , Shanghai 1992, 1997[1] 200 600 78,000[1] BCD, HV
ASMC[319] FAB 3 China , Shanghai 2004[1] 200 250 12,000[1]
Beilling[320] China , Shanghai 150 1200 BiCMOS, CMOS
SiSemi[321] China , Shenzhen, Longgang High-tech Industrial Park[322] 2004 130 Power semiconductors, LED drivers, bipolar power transistors, power MOSFETs
SiSemi[322] 1997 100 Transistors
CRMicro (formerly CSMC)[323] Fab 1 1998[1] 150[324] 60,000[1] HV Analog, MEMS, Power, Analog, Foundry
CRMicro (formerly CSMC) Fab 2 China , Wuxi 2008[1] 200[324] 180, 130 40,000[1] HV Analog, Foundry
CRMicro (formerly CSMC) Fab 3 1995[1] 200[324] 130 20,000[1]
CRMicro (formerly CSMC) Fab 5 2005[1] 30,000[1]
Huali (Shanghai Huali Microelectronics Corp, HLMC)[7][325] F1 China , Shanghai 300 193, 55, 40, 28[326] 35,000 Foundry
Huali[7] F2 China , Shanghai Under construction 300 40,000
Nexchip[7] N1[327] China , Hefei Q4 2017 300 40,000 Display Drivers IC[328]
Nexchip[7] N2[327] China , Hefei Under construction 300 40,000
Nexchip[7] N3[327] China , Hefei Under construction 300 40,000
Nexchip[7] N4[327] China , Hefei Under construction 300 40,000
Wandai[7] CQ China , Chongqing Under construction 300 20,000
San'an Optoelectronics Tianjin San’an Optoelectronics Co., Ltd. China , Tianjin LEDs
San'an Optoelectronics Xiamen San’an Optoelectronics Technology Co., Ltd. China LEDs
San'an Optoelectronics Xiamen San’an Integrated Circuit China ICs
San'an Optoelectronics Xiamen San’an Optoelectronics Co., Ltd. China LEDs
San'an Optoelectronics Fujian Jing’an Optoelectronics Co., Ltd. China LEDs
San'an Optoelectronics Wuhu Anrui Optoelectronics Co., Ltd. China LEDs
San'an Optoelectronics Anrui San'an Optoelectronics Co., Ltd. China LEDs
San'an Optoelectronics Anrui San'an Technology Co., Ltd. China LEDs
San'an Optoelectronics Luminus Summary USA LEDs
San'an[329] China , Xiamen Foundry, GaN, Power, RF
HuahongGrace[330] FAB China , Shanghai 300 90 Foundry
HuahongGrace (HHGrace, Huahong Grace, Shanghai Huahong Grace Semiconductor Manufacturing Corporation) China , Zhangjiang 200 1000–90 53,000 Foundry, eNVM, RF, Mixed Signal, Logic, Power Management, Power Discrete
HuahongGrace China , Jinqiao 200 1000–90 53,000 Foundry, eNVM, RF, Mixed Signal, Logic, Power Management, Power Discrete
HuahongGrace China , Shanghai 200 1000–90 53,000 Foundry, eNVM, RF, Mixed Signal, Logic, Power Management, Power Discrete
HuaLei Optoelectronic China LEDs[331]
Sino King Technology[6] China , Hefei 2017 DRAM
APT Electronics China , Guangzhou[1] 2006[1]
Aqualite China , Guangzhou[1] 2006[1]
Aqualite China , Wuhan[1] 2008[1]
Xiamen Jaysun Semiconductor Manufacturing Fab 101 China , Xiamen[1] 0.035 2011[1]
Xiyue Electronics Technology Fab 1 China , Xian[1] 0.096 2007[1]
Hanking Electronics Fab 1 China, Liaoning, Fushun 2018 200 10,000 MEMS Foundry, MEMS Design, MEMS Sensors (Inertial, Pressure, Ultrasound, Piezoelectric, LiDar, Bolometer )
CanSemi[332] China , Guanzhou 4 300 180–130 Foundry[333]
SensFab Singapore [1] 1995[1]
MIMOS Semiconductor Malaysia, Kuala Lumpur[1] 0.006, 0.135 1997, 2002[1]
Silterra Malaysia Fab1 Malaysia, Kedah, Kulim 1.6 2000 200 250, 200, 180–90 46,000 CMOS, HV, MEMS, RF, Logic, Analog, Mix Signal
Pyongyang Semiconductor Factory 111 Factory North Korea, Pyongyang 1980s 3000[334]
Kim Il-sung Fab[334] Il-sung North Korea, Pyongyang 1965s 76 14/22[334] 25000–55000 OLEDs, Sensors, DRAM, SRAM, CMOS, Photodiodes, IGBT, MOSFET, MEMS
DongbuHiTek Fab 1 South Korea , Bucheon[1] 1997[1] Foundry
DongbuHiTek Fab 2 South Korea , Eumsung-Kun[1] 2001[1] Foundry
DongbuHiTek Fab 2 Module 2 South Korea , Eumsung-Kun[1] Foundry
Kodenshi AUK Group[335] Silicon FAB Line
Kodenshi AUK Group[335] Compound FAB Line
Kyocera SAW devices[136]
Seiko Instruments[336] China, Shanghai
Seiko Instruments[336] Japan, Akita
Seiko Instruments[336] Japan, Takatsuka
NIPPON PRECISION CIRCUITS[63] Digital
Epson[337] T wing Japan, Sakata 1997 200 150–350 25,000
Epson[337] S wing Japan, Sakata 1991 150 350–1200 20,000
Olympus Corporation[338] Nagano Japan, Nagano Prefecture MEMS[339]
Olympus Japan MEMS[340]
Shindengen Electric Manufacturing[341] Philippines, Laguna
Shindengen Electric Manufacturing[341] Thailand, Lumphun
NKK JFE Holdings[63] 200 6000 ,
New Japan Radio Kawagoe Works Japan , Saitama Prefecture, Fujimino City[342][343] 1959[63] 100, 150 4000, 400, 350 Bipolar, Mixed Signal, Analog, Hi Speed BiCMOS, BCD, 40V Hi Speed Complementary Bipolar, Analog CMOS+HV,

SAW Filters[344]

New Japan Radio Saga Electronics[345] Japan , Saga Prefecture 100, 150 4000, 400, 350[346] Foundry, Bipolar, Mixed Signal, Analog, Hi Speed BiCMOS, BCD, 40V Hi Speed Complementary Bipolar, Analog CMOS+HV,

SAW Filters[344]

New Japan Radio NJR FUKUOKA Japan , Fukuoka Prefecture, Fukuoka City[345] 2003[347] 100, 150 Bipolar, Analog ICs, MOSFETs LSI, BiCMOS ICs
New Japan Radio Japan , Nagano, Nagano City[348]
New Japan Radio Japan , Nagano, Ueda City[348]
Nichia YOKOHAMA TECHNOLOGY CENTER[349] Japan , KANAGAWA LEDs
Nichia SUWA TECHNOLOGY CENTER[349] Japan , NAGANO LEDs
AKM Semiconductor, Inc. FAB1 Japan , Nobeoka Sensors
AKM Semiconductor, Inc. FAB2 Japan , Nobeoka
AKM Semiconductor, Inc. FAB3 Japan , Fuji Sensors
AKM Semiconductor, Inc. FAB FP Japan , Hyuga
AKM Semiconductor, Inc. FAB5 Japan , Ishinomaki LSI
Taiyo Yuden Japan , Nagano SAW devices[136]
Taiyo Yuden Japan , Ome SAW devices[136]
NMB SEMICONDUCTOR[63] DRAM
Elmos Semiconductor Germany , Dortmund[350] 1984 200 800, 350 9000 HV-CMOS
United Monolithic Semiconductors[351] Germany , Ulm 100 700, 250, 150, 100 Foundry, FEOL, MMIC, GaAs pHEMT, InGaP, GaN HEMT, MESFET, Schottky diode
United Monolithic Semiconductors[351] France , Yvette 100 Foundry, BEOL
Innovative Ion Implant France 51–300[352]
Innovative Ion Implant UK 51–300[352]
nanoPHAB Netherlands, Eindhoven 50–100 10–50 2–10 MEMS
Micron Semiconductor Ltd.[353] Lancing UK, West Sussex, Lancing Detectors
PragmatIC FlexLogIC 001 UK, Co. Durham 2018 200 800–320 Flexible Semiconductor /

Foundry and IDM

CSTG UK, Glasgow[1][354] 2003[1] 76, 100 InP, GaAs, AlAs, AlAsSb, GaSb, GaN, InGaN, AlN, diodes, LEDs, lasers, PICs, Optical amplifiers, Foundry
Photonix UK, Glasgow[1] 0.011 2000[1]
Silex Microsystems Sweden , Jarfalla[1] 0.009, 0.032 2003, 2009[1]
OptoTeltronics Sp. z o.o. Poland, Gdynia 1.3[1] 1990[1] 200 65–200 45,000[1]
Integral Belarus, Minsk 1963 100, 150, 200 2000, 1500, 350
Crocus Nano Electronics CNE Russia , Moscow 2015 300 65 4000 MRAM, RRAM, MEMS, IPD, TMR, GMR Sensors, foundry
Mikron Russia , Zelenograd 65–180
VSP Mikron WaferFab[355] Russia , Voronezh 1959 100/150 900+ 6000 Analog, power

Number of open fabs currently listed here: 528

(NOTE: Some fabs located in Asia don't use the number 4, or any 2 digit number that adds up to 4, because it is considered bad luck; see tetraphobia.)

Closed plants

Defunct fabs include:

Company Plant Name Plant Location Plant Cost (in US$ Billions) Started Production Wafer Size (mm) Process Technology Node (nm) Production Capacity (Wafers/Month) Technology / Products Ended Production
Soviet Union Jupiter Ukraine, Kiev, Pripiat 1980 Secret government semiconductor fab closed by Chernobyl disaster 1996
Tower Semiconductor (formerly Micron) Fab 4[356] Japan , Nishiwaki City 0.450[1] 1992[1] 200 95 60,000[1] DRAM, foundry 2014
Tower Semiconductor - Tacoma China, Nanjing[357][358] halted, bankruptcy in June 2020[359] 200, 300 (planned) Foundry 2020
Fujian Jinhua(JHICC)[7][360][361][362] F2 China , Jinjiang 5.65[363] 2018 (planned) 300 22 60,000 DRAM[6] 2018
Decoma[7] F2 China , Huaian Under construction 300 20,000 2020
Wuhan Hongxin Semiconductor Manufacturing (HSMC)[364] China , Wuhan 2019 (halted) 300 14, 7 Foundry 2020
Tsinghua Unigroup - Unigroup Guoxin (Unigroup, Xi'an UniIC Semiconductors Co., Ltd.)[7] SZ China , Shenzhen 12.5 Planned 300 50,000 DRAM 2019 (just plan)
TSMC Fab 1[200] Taiwan , Hsinchu 1987 150 20,000 Foundry March 9, 2001
UMC Fab 1 Japan , Tateyama 0.543[1] 1997[1] 200 40,000 Foundry 2012
SK Hynix E-4 USA , OR, Eugene 1.3 2007 200 30,000 DRAM 2008[365]
Symetrix - Panasonic[366] Brazil 0.9 (planned) planned FeRAM (just plan)
Rohm (formely Data General) USA , CA, Sunnyvale[367]
Kioxia Fab 1 (at Yokkaichi Operations)[368] Japan , Yokkaichi 1992 200 400 35,000 SRAM, DRAM September, 2001
NEC Livingston[369] Scotland, West Lothian, Livingston 4.5 (total) 1981 200 250, 180 30,000 DRAM April 2001
LFoundry (formerly Renesas Electronics)[370] Germany , Landshut 1992 200 2011
LFoundry (formerly Atmel)[371] France , Rousset ? 200 25.000[372] 2014
EI Niš Ei Poluprovodnici Serbia, Niš 1962 100 2000
Plessey Semiconductors (formerly Plus Semi) (formerly MHS Electronics) (formerly Zarlink) (formerly Mitel) (formerly Plessey Semiconductors) UK, Swindon[1]
Telefunken Semiconductors Heilbronn, HNO-Line Germany , Heilbronn 0.125[1] 1993[1] 150 10,000 2015
Qimonda Richmond[373] USA , VA, Richmond 3 2005 300 65 38,000 DRAM January, 2009
STMicroelectronics (formerly NORTHERN TELECOM SEMICONDUCTOR[63]) 100, 150 NMOS, CMOS
Freescale Semiconductor (formerly Motorola) Toulouse Fab[374] France , Toulouse 1969 150 650 Automotive 2012[375]
Freescale Semiconductor (formerly Motorola) (formerly Tohoku Semiconductor) Sendai Fab[376] Japan , Sendai 1987 150, 200 500 DRAM, microcontrollers, analog, sensors 2009?
Agere (formerly Lucent) (formerly AT&T)[377] Spain, Madrid, Tres Cantos 0.67[378] 1987[379] 300, 350, 500 CMOS 2001
GMT Microelectronics (formerly Commodore Semiconductor) (formerly MOS Technology) USA , PA, Audubon 1969
1976
1995		 1000 1976
1992[380]
2001
Integrated Device Technology USA , CA, Salinas 1985 150 350–800[128] 2002
ON Semiconductor (formerly Cherry Semiconductor) USA , RI, Cranston 2004
Intel Fab 8[34] Israel , Jerusalem 1985 150 Microprocessors, Chipsets, Microcontrollers[35] 2007
Intel Fab D2 USA , CA, Santa Clara 1989 200 130 8,000 Microprocessors, Chipsets, Flash memory 2009
Intel Fab 17[27][26] USA , MA, Hudson 1998 200 130 Chipsets and other[26] 2014
Fairchild Semiconductor (formerly National Semiconductor) West Jordan USA , UT, West Jordan 1977 150 2015[381]
Texas Instruments HFAB USA , TX, Houston 1967 150 2013[382]
Texas Instruments (formerly Silicon Systems) Santa Cruz USA , CA, Santa Cruz 0.250 1980 150 800 80,000 HDD 2001
Texas Instruments (formerly National Semiconductor) Arlington USA , TX, Arlington 1985 150 80000, 35000 2010
Unknown (fortune 500 company) USA , East Coast[383] 150 1,600 MEMS 2016
Diodes Incorporated (formerly Lite-On Power Semiconductor) (formerly AT&T) KFAB USA , MO, Lee's Summit 1994[384] 130 2017[385]
Qorvo (formerly TriQuint Semiconductor) (formerly Sawtek) USA , Apopka[40][386] SAW filters 2019
GlobalFoundries Abu Dhabi[1] UAE, Abu Dhabi[1] 6.8[1] (planned) 2016[1] (planned) 300 110–180 45,000 Foundry 2011 (plan stopped)
GlobalFoundries - Chengdu China , Chengdu[387] 10 (planned) 2018 (planned), 2019 (second phase) 300 180/130 (cancelled), 22 (second phase) 20,000 (85,000 planned) Foundry, FDSOI (second phase) 2020 (was idle)

Number of closed fabs currently listed here: 40

See also

References
  1. "SEMI World Fab Forecast 2013".
  2. "Fab Information". Umc.com.
  3. "Mie Plant - Fujitsu Global". Fujitsu.com.
  4. "Fujitsu says sayonara to semiconductor biz, thousands of staff".
  5. "Archived copy". Archived from the original on 2011-06-20. Retrieved 2011-06-16.CS1 maint: archived copy as title (link)
  6. "Is China ready for a memory chip fab? - EE Times Asia". Retrieved 2018-02-12.
  7. "Much Ado About China's Big IC Surge; EE Times". Eetimes.com. 2017-06-22. Retrieved 2017-06-22.
  8. "3D NAND Fab Seen as Milestone for China | EE Times". EETimes. Retrieved 2017-12-29.
  9. "SMIC - Fab Information". Smics.com. Archived from the original on 2011-11-27. Retrieved 2017-03-22.
  10. "SMIC Presentation" (PDF). Smics.com. 2017-05-01. Archived from the original (PDF) on 2017-06-08. Retrieved 2017-06-22.
  11. "Chinese semiconductor maker SMIC plans US$3.59 billion Beijing plant | South China Morning Post". Scmp.com. Retrieved 2017-03-22.
  12. "LFoundry: New Frontiers, New Opportunities". Applied Materials. 2014-04-01. Retrieved 2017-03-22.
  13. "Nanya to spend over $800M on DRAM fab | EE Times". EETimes. Retrieved 2018-01-05.
  14. "Google Maps". Google Maps. Retrieved 2018-01-09.
  15. "Contact Us". Nanya.com. Retrieved 2018-01-09.
  16. "Taiwan's Nanya Technology to invest $1.85 bln to boost memory chip out". Reuters. 2017-08-01. Retrieved 2018-01-09.
  17. Dave Morgan (2010-12-30). "Company Spotlight: Micron Technology, Inc". SemiAccurate.com. Retrieved 2017-03-22.
  18. Andrew Mierau. "Micron Technology, Inc. - Home | Memory and Storage Solutions". Micron.com. Retrieved 2017-03-22.
  19. "Micron Singapore. - Singapore - Electronics Company". Facebook. Retrieved 2017-03-22.
  20. "Intel, Micron open US$3 billion NAND flash facility in Singapore". DigiTimes. 2011-04-11. Retrieved 2011-04-11.
  21. "Security Check Required". Facebook. Retrieved 2017-03-22.
  22. "Micron Technology Completes Acquisition of Inotera Memories of Taiwan (NASDAQ:MU)". Investors.micron.com. Retrieved 2017-03-22.
  23. "Micron Semiconductor Asia Pte. Ltd. - Singapore - Commercial & Industrial". Facebook. Retrieved 2017-03-22.
  24. "Taichung". Micron.com. Archived from the original on 2018-01-09. Retrieved 2018-01-09.
  25. "Inotera memories". 2015-04-27. Archived from the original on 2015-04-27. Retrieved 2018-01-09.
  26. "Intel Global Manufacturing Facts" (PDF). Download.intel.com. Retrieved 2017-03-22.
  27. "Moore's Law Around the World, in Bricks and Mortar". 2010-10-21. Archived from the original on July 13, 2011.
  28. "Intel Announces Multi-Billion-Dollar Investment in Next-Generation Manufacturing in U.S. | Intel Newsroom". Newsroom.intel.com. Retrieved 2017-03-22.
  29. Pallatto, John. "Intels $3 Billion Fab Now Open for Business". Eweek.com. Retrieved 2017-03-22.
  30. "Intel to Invest More than $5 Billion to Build New Factory in Arizona | Intel Newsroom". Newsroom.intel.com. Retrieved 2017-03-22.
  31. Swartz, Jon (2011-03-29). "Intel's new $5 billion plant in Arizona has Obama's blessing". Usatoday.com. Retrieved 2011-03-28.
  32. "Intel will invest $7 billion to finish a factory it started in 2011".
  33. "Intel and Trump Announce $7B for Fab 42 Targeting 7nm". HPCwire. 2017-02-08. Retrieved 2017-03-18.
  34. "Intel in Israel: A Old Relationship Faces New Criticism". Knowledge.wharton.upenn.edu. 2014-09-29. Retrieved 2017-03-22.
  35. "Intel Israel Fab Tour - The First Official Intel Press Event in Israel". Ixbtlabs.com. Retrieved 2017-03-22.
  36. "INTEL Ireland Fab 24 NOW Recruiting - CareersPortal.ie". www.careersportal.ie. Retrieved 2015-10-20.
  37. Pallatto, John. "Intel Opens $2.5 Billion Fab Plant in China". Eweek.com. Retrieved 2017-03-22.
  38. "Intel in Dalian, China". Intel.com. Retrieved 2016-08-04.
  39. "Camera Cores & Components - FLIR Systems". Flir.com. Retrieved 17 July 2018.
  40. "Locations - Qorvo". www.qorvo.com.
  41. "Worldwide Locations - Maxim". Maximintegrated.com. 2016-08-22. Retrieved 2017-03-22.
  42. "Apple buys former Maxim chip fab in North San Jose, neighboring Samsung Semiconductor". AppleInsider.
  43. "Worldwide Locations - Maxim". Maximintegrated.com. 2016-08-22. Retrieved 2017-03-22.
  44. http://scl.gov.in/
  45. https://www.drdo.gov.in/labs-establishment/about-us/society-integrated-circuit-technology-and-applied-research-sitar
  46. http://www.sitar.org.in/starc/index.html
  47. http://www.sitar.org.in/starc/index.html
  48. https://www.drdo.gov.in/labs-establishment/about-us/society-integrated-circuit-technology-and-applied-research-sitar
  49. http://www.sitar.org.in/starc/index.html
  50. http://www.sitar.org.in/starc/index.html
  51. https://www.drdo.gov.in/labs-establishment/about-us/society-integrated-circuit-technology-and-applied-research-sitar
  52. http://www.gaetec.org/
  53. http://www.gaetec.org/
  54. "TowerJazz Completes Acquisition of Maxim's Fabrication Facility in San Antonio, Texas" (PDF). towerjazz.com. 2016-02-02. Retrieved 2017-05-25.
  55. "Manufacturing at Tower Semiconductor". towersemi.com.
  56. "Manufacturing at Tower Semiconductor". Towersemi.com. Retrieved 2017-03-22.
  57. "Manufacturing Facilities – Tower Panasonic Semiconductor Co". Tpsemico.com. Retrieved 2018-07-20.
  58. "About Foundry Service - Nuvoton". Nuvoton.com.
  59. "Rohm Buys Renesas Wafer Fab". EE Times. Retrieved 2018-07-20.
  60. "Oki Semiconductor Distributor | Mouser". www.mouser.com.
  61. LTD., LAPIS Semiconductor CO. "History | Company | LAPIS Semiconductor". Lapis-semi.com. Archived from the original on 2017-10-26. Retrieved 2018-02-17.
  62. "Kionix, Inc., Company Profile - global". Kionix.com.
  63. Fletcher, A. (2013-10-22). Profile of the Worldwide Semiconductor Industry - Market Prospects to 1997: Market Prospects to 1997. Elsevier. ISBN 9781483284859.
  64. "Japan earthquakes close Oki wafer fab". EE Times. Retrieved 2018-07-20.
  65. "大町工場 ｜ 富士電機パワーセミコンダクタ株式会社". Fujielectric.co.jp.
  66. "飯山工場 ｜ 富士電機パワーセミコンダクタ株式会社". Fujielectric.co.jp.
  67. "北陸工場 ｜ 富士電機パワーセミコンダクタ株式会社". Fujielectric.co.jp.
  68. "本社 ｜ 富士電機パワーセミコンダクタ株式会社". Fujielectric.co.jp.
  69. "History of Fujitsu's Semiconductor Business : FUJITSU SEMICONDUCTOR". Fujitsu.com.
  70. "Odds of Success of Mie Fujitsu, Japan's Pure-Play Foundry". EE Times. Retrieved 2018-07-20.
  71. "MIE FUJITSU SEMICONDUCTOR LIMITED". Fujitsu.com.
  72. "Fujitsu to Construct New Fab for Logic Chips Employing 65nm Process Technology and 300mm Wafers - Fujitsu United States". Fujitsu.com. Retrieved 2017-03-22.
  73. "Japan Plants - Fujitsu Global". Fujitsu.com. Retrieved 2017-03-22.
  74. "Fujitsu invests in 65nm fab at Mie". 11 January 2006.
  75. "Odds of Success of Mie Fujitsu, Japan's Pure-Play Foundry". EE Times. Retrieved 2018-07-20.
  76. "Odds of Success of Mie Fujitsu, Japan's Pure-Play Foundry". EE Times. Retrieved 2018-07-20.
  77. "Suzaka Plant - Fujitsu Global". Fujitsu.com.
  78. "Iwate Plant - Fujitsu Global". Fujitsu.com.
  79. "History : FUJITSU SEMICONDUCTOR". Fujitsu.com.
  80. "DENSO Global Website". DENSO Global Website.
  81. "DENSO Iwate to Build a New Plant and Expand Production as Part of Efforts to Enhance the DENSO Group Production System - News - DENSO Global Website". Denso.com.
  82. "Denso to expand Iwate plant to produce instrument clusters". Just-auto.com. 29 March 2017.
  83. "Canon Inc. Operations - Canon Global". Canon Global.
  84. "Canon wants its image sensors in others' cars, robots". Nikkei Asian Review.
  85. CORPORATION, SHARP. "環境に配慮したモノづくり 工場からエコ".
  86. "About us - Company Data - JAPAN SEMICONDUCTOR CORPORATION". www.jsemicon.co.jp.
  87. "Toshiba : Press Release (9 Feb, 2017): Toshiba Starts Construction of Fab 6 and Memory R&D Center at Yokkaichi, Japan". Toshiba.co.jp.
  88. "Data" (PDF). www.toshiba.co.jp.
  89. "Yokkaichi | The Memory Guy". thememoryguy.com.
  90. "Did Toshiba REALLY Lose 3-6 Weeks' Production? | The Memory Guy". thememoryguy.com.
  91. "Ransomware attack on Toshiba means 400,000TB of SSD storage is missing". PCGamesN.
  92. "Toshiba reportedly suspends NAND flash production in Japan". DIGITIMES.
  93. "Press Release (12 Jul, 2011): Toshiba and SanDisk Celebrate the Opening of Fab 5 300mm NAND Flash Memory Fabrication Facility in Japan". Toshiba.co.jp. 2011-07-12. Retrieved 2017-03-22.
  94. "Toshiba and SanDisk Celebrate the Opening of the Second Phase of Fab 5 and Start Construction of the New Fab 2 Semiconductor Fabrication Facility at Yokkaichi, Japan". Sandisk.com. Retrieved 2015-10-20.
  95. "Toshiba : Press Releases 13 April, 2004". Toshiba.co.jp.
  96. "Toshiba : Press Releases 04 September, 2007". Toshiba.co.jp.
  97. "Toshiba : Press Releases 31 May, 2006". Toshiba.co.jp.
  98. "Toshiba : Press Releases 2 February, 2004". Toshiba.co.jp.
  99. "Toshiba : Press Release (9 Feb, 2017): Toshiba Starts Construction of Fab 6 and Memory R&D Center at Yokkaichi, Japan". Toshiba.co.jp.
  100. "Information" (PDF). www.toshiba.co.jp.
  101. "Toshiba : Press Release (8 Nov, 2016): Toshiba to Expand 3D Flash Memory Production Capacity by Building New Fabrication Facility at Yokkaichi". Toshiba.co.jp.
  102. "Toshiba looks to build new Yokkaichi chip plant without partner Western Digital, further fueling feud". Japan Times Online. 4 August 2017.
  103. "Western Digital to invest $4.6bn in joint venture with Toshiba". Nikkei Asian Review.
  104. https://www.japantimes.co.jp/news/2017/10/12/business/corporate-business/toshiba-invest-extra-¥110-billion-yokkaichi-plant-amid-row-western-digital/#.W2YBitJKjIU
  105. "Toshiba : Press Release (15 Jul, 2016): Toshiba and Western Digital Celebrate the Opening of New Fab 2 Semiconductor Fabrication Facility in Yokkaichi, Japan". Toshiba.co.jp.
  106. "Toshiba and Western Digital Celebrate the Opening of New Fab 2 Semiconductor Fabrication Facility in Yokkaichi, Japan". Businesswire.com.
  107. Shilov, Anton. "Toshiba Memory to Build New Fab to Produce BiCS 3D NAND". www.anandtech.com.
  108. Shilov, Anton. "Toshiba Begins to Construct New BiCS 3D NAND Fab in Iwate Prefecture". www.anandtech.com.
  109. Shilov, Anton. "Toshiba to Build New Fab to Produce BiCS NAND Flash". www.anandtech.com.
  110. Shilov, Anton. "Toshiba Memory & Western Digital Finalize Fab K1 Investment Agreement". www.anandtech.com.
  111. "Western Digital Process Technician Job in Fremont, CA | Glassdoor". www.glassdoor.com. Archived from the original on 2018-02-20. Retrieved 2018-02-20.
  112. "Vacature voor een functie als Process Technician bij Western Digital …". archive.is. 2018-02-20. Archived from the original on 2018-02-20. Retrieved 2018-02-20.
  113. Ltd., Hitachi Power Semiconductor Device. "Company Office : Hitachi Power Semiconductor Device, Ltd". Hitachi-power-semiconductor-device.co.jp.
  114. "ABB inaugurates new semiconductor manufacturing unit in Switzerland". Abb.com.
  115. "MITSUBISHI ELECTRIC Global website". MITSUBISHI ELECTRIC Global Website.
  116. "三菱電機 三菱電機について 拠点情報". 三菱電機 オフィシャルサイト.
  117. "三菱電機 三菱電機について 拠点情報". 三菱電機 オフィシャルサイト.
  118. "Archived copy". Archived from the original on 2011-07-20. Retrieved 2011-05-27.CS1 maint: archived copy as title (link)
  119. 力晶科技股份有限公司. "About Powerchip". 力晶科技股份有限公司.
  120. 力晶科技股份有限公司. "Technologies & Services". 力晶科技股份有限公司. Archived from the original on 2017-09-07. Retrieved 2017-09-07.
  121. "Global Operations".
  122. "Panasonic and Renesas Start Operation of New Development Line for Leading-Edge SoC Process Technologies at the Renesas Naka Site".
  123. "TSMC's huge Fab 6 cranks out 8-inch wafers, but sets 300-mm pace". EE Times. Retrieved 2018-07-20.
  124. "TSMC to acquire WSMC foundry". EE Times. Retrieved 2018-07-20.
  125. "NEC to build 300mm wafer fab in Roseville". EE Times. Retrieved 2018-07-20.
  126. "Article". www.bizjournals.com. 2010.
  127. "Short Take: NEC announces $1.4b chip plant for Roseville, California". 1 June 1998.
  128. "IDT to Close Salinas Wafer Fab, Cut 260 Jobs". EDN. Retrieved 2018-07-20.
  129. Commission, United States International Trade (17 July 1992). "DRAMs of one megabit and above from the Republic of Korea: determination of the Commission in investigation no. 731-TA-556 (preliminary) under the Tariff Act of 1930, together with the information obtained in the investigation". The Commission – via Google Books.
  130. Anderson, Mark. "Telefunken no more: Company changes name to TSI Semiconductors". Bizjournals.com. Sacramento Business Journal. Retrieved 2014-06-30.
  131. "Renesas sells U.S. fab to Telefunken". EE Times. 2011-03-30. Retrieved 2011-05-31.
  132. "Micronas Builds Second Fab Module to Meet Market Demands (0007) - micronas.com". Micronas.com.
  133. "Company - micronas.com". Micronas.com.
  134. "Renesas to Transfer 5-inch Wafer Fab to TDK | Electronics360". electronics360.globalspec.com. Retrieved 2018-02-21.
  135. "TDK and Renesas Electronics Sign Basic Agreement on Transfer of Renesas Electronics Subsidiary's Tsuruoka Factory | Press Releases | TDK". www.global.tdk.com. Retrieved 2018-02-21.
  136. "Fab Capacity Increasing through Acquisition of Legacy Semiconductor Facilities - SEMI.ORG". Semi.org.
  137. "TDK HDD Head Wafer Fab Upgrades to Version 5.6 of FabTime Software, Renews Maintenance Contract". Retrieved 2018-02-21.
  138. "Tronics opens MEMS wafer fab in Texas". EETE Analog. 2017-05-01. Retrieved 2018-02-21.
  139. "Peregrine Semi and OKI Achieve Record UltraCMOS™ RFIC Output - pSemi". www.psemi.com. Retrieved 2018-02-17.
  140. "金沢村田製作所 新生産棟竣工式について - 村田製作所". Murata.com.
  141. "会社概要 - 金沢村田製作所". Murata.com.
  142. "仙台工場 - 金沢村田製作所". Murata.com.
  143. "製品情報 - 金沢村田製作所". Murata.com.
  144. "Murata Manufacturing Company, Ltd. Yasu Division - Murata Manufacturing Co., Ltd". Murata.com.
  145. "mitsumi web". Mitsumi.co.jp.
  146. "生産拠点一覧｜会社案内｜ソニーセミコンダクタマニュファクチャリング株式会社". Sony-semiconductor.co.jp. Archived from the original on 2019-07-13. Retrieved 2017-08-23.
  147. "Status of Sony Group Manufacturing Operations Affected by the East Japan Earthquake, Tsunami and Related Power Outages". Sony Global - Sony Global Headquarters.
  148. "Sony Establishes Yamagata Technology Center to Increase Production Capacity for CMOS Image Sensors". Sony Global - Sony Global Headquarters.
  149. "Nintendo and the Wii U May Be in Trouble due to Closure of Vital Semiconductor Factory". 4 August 2013.
  150. "가비아 호스팅 서비스:웹호스팅,웹메일호스팅,쇼핑몰호스팅,단독서버,동영상호스팅". errdoc.gabia.net. Archived from the original on 2019-07-14. Retrieved 2019-07-02.
  151. "Global Network < ABOUT US < SK hynix". Skhynix.com.
  152. "History < ABOUT US < SK hynix". Skhynix.com.
  153. "Press Release < PR < SK hynix". Skhynix.com.
  154. Shilov, Anton. "SK Hynix to Build a New NAND Fab, Upgrade Existing DRAM Fab".
  155. "Archived copy". Archived from the original on 2017-10-14. Retrieved 2017-10-05.CS1 maint: archived copy as title (link)
  156. "Diodes Incorporated: Analog, Discrete, Logic, and Mixed-Signal ICs". Diodes.com. Retrieved 2017-03-22.
  157. "Diodes Incorporated to Acquire BCD Semiconductor Manufacturing Limited - Diodes Incorporated". www.diodes.com. Archived from the original on 2017-11-07. Retrieved 2017-11-05.
  158. www.akacia.com.tw, Designed by Akacia System | 旭亞系統設計(股)公司. "Worldwide Contact - Liteon". optoelectronics.liteon.com.
  159. "Lite-On Semiconductor Corp. offers a series of discretes, rectifiers, analog ICs, foundry service, Contact Image Sensors, Ambient Light Sensors, Proximity Sensors, Optical Touch Panel Sensors etc". www.liteon-semi.com.
  160. "Philips Photonics". www.photonics.philips.com.
  161. "Philips plans to double size of MEMS foundry". 29 September 2016.
  162. "Manufacturing - Nexperia". Nexperia.com.
  163. "NXP in the Netherlands|NXP". Nxp.com. Retrieved 2018-03-08.
  164. "NXP Semiconductors | Automotive, Security, IoT". Freescale.com. Retrieved 2017-03-22.
  165. "R & D Collaboration on Trial: The Microelectronics and Computer Technology Corporation". Harvard Business School Press. 1994. ISBN 9780875843643. Retrieved 2011-10-06.
  166. "NXP Semiconductors | Automotive, Security, IoT". Freescale.com. Retrieved 2017-03-22.
  167. "Manufacturing Locations | Everspin". Everspin.com. Retrieved 2018-02-08.
  168. "Motorola Restarts MOS 12 Facility Expansion". Electronic News. 1999. Archived from the original on 2012-07-08. Retrieved 2011-10-06.
  169. "Archived copy". Archived from the original on 2015-10-21. Retrieved 2015-07-21.CS1 maint: archived copy as title (link)
  170. Patricia A. Wilson (2010-07-22). Exports and Local Development: Mexico's New Maquiladoras. p. 82. ISBN 9780292785571. Retrieved 2017-03-22.
  171. "SKYWORKS : Locations". www.skyworksinc.com.
  172. "WIN Semiconductors Corp. - Our Locations". www.winfoundry.com. Retrieved 2018-01-09.
  173. "WIN Semiconductors Corp. Overview". www.winfoundry.com. Retrieved 2018-01-09.
  174. "Manufacturing Facility in Oregon". Onsemi.com. Retrieved 2017-03-22.
  175. "Design & Manufacturing Center in Idaho". Onsemi.com. Retrieved 2017-03-22.
  176. "Manufacturing Facility in Japan". Onsemi.com.
  177. "Ailing Sanyo asks employees to buy company products". Japan Times Online. 30 January 2005.
  178. "Message from the President | USJC：United Semiconductor Japan Co., Ltd".
  179. "AIZU FUJITSU SEMICONDUCTOR LIMITED". Fujitsu.com.
  180. "Aizu Wakamatsu Plant - Fujitsu Global". Fujitsu.com.
  181. "Business : AIZU FUJITSU SEMICONDUCTOR LIMITED". Fujitsu.com.
  182. "Fujitsu Semiconductor starts operations of new foundry companies : FUJITSU SEMICONDUCTOR". Fujitsu.com.
  183. "Foundry Services : FUJITSU SEMICONDUCTOR". www.fujitsu.com.
  184. "Foundry Services - Fujitsu United States". www.fujitsu.com.
  185. "environmental sensors, light sensors, image sensors, audio sensors, optical sensors - sensing is life". Ams.com. 2017-03-16. Retrieved 2017-03-22.
  186. "Osram puts €2bn R&D and plans biggest LED fab". 9 December 2015.
  187. "Osram Inaugurates New Kulim 6-inch LED Chip Fab - LEDinside". www.ledinside.com.
  188. Siu Han, Taipei; Adam Hwang, DIGITIMES (2017-10-16). "Osram Opto Semiconductors to start production at new Malaysia plant". Digitimes.com. Retrieved 2018-07-20.CS1 maint: multiple names: authors list (link)
  189. "Osram LED chip plant in Penang now in operation". www.ledsmagazine.com.
  190. "Archived copy". Archived from the original on 2017-11-07. Retrieved 2017-11-05.CS1 maint: archived copy as title (link)
  191. "Archived copy". Archived from the original on 2017-11-07. Retrieved 2017-11-05.CS1 maint: archived copy as title (link)
  192. "Osram Optoelectronics Chip Factory, Regensburg - Semiconductor Technology".
  193. "Archived copy". Archived from the original on 2011-10-08. Retrieved 2011-05-27.CS1 maint: archived copy as title (link)
  194. "Winbond - Locations". Winbond.com.
  195. "CTSP Fab, Winbond Electronics Corp". Jjpan.com.
  196. "CTIMES News - Winbond to Establish Factory in Kaohsiung to Manufacture Niche Type DRAM and Flash Memory". en.ctimes.com.tw. Retrieved 17 July 2018.
  197. "VIS - Specialty IC Foundry of Choice". Vis.com.tw. Retrieved 2017-12-19.
  198. "Archived copy". Archived from the original on 2014-06-25. Retrieved 2014-08-06.CS1 maint: archived copy as title (link)
  199. "Fab Locations". Taiwan Semiconductor Manufacturing Company Limited. Retrieved 2012-04-21.
  200. "TSMC to close fab that started foundry movement". EE Times. Retrieved 2018-07-20.
  201. "TSMC will buy chip venture from Acer to boost foundry capacity". EE Times. Retrieved 2018-07-20.
  202. "TSMC takes full ownership of Acer Group foundry operations". EE Times. Retrieved 2018-07-20.
  203. "TSMC buys out Acer fab". EE Times. Retrieved 2018-07-20.
  204. "TSMC starts 300-mm fab construction, but shifts Fab 7 plans to 8 inch". EE Times. Retrieved 2018-07-20.
  205. "Taiwan Semiconductor Manufacturing Company Limited". Tsmc.com.
  206. "TSMC Acquires PSC Land for New Fab Construction". Taiwan Economic News. 2011-01-13. Archived from the original on 2011-07-24. Retrieved 2011-01-13.
  207. Divide 2 million by 12, rounded
  208. "TSMC breaks ground on $9B fab complex | EE Times". EETimes. Retrieved 2017-12-17.
  209. "TSMC Breaks Ground on Fab 18 in Southern Taiwan Science Park". Tsmc.com.
  210. Shilov, Anton. "TSMC Starts to Build Fab 18: 5 nm, Volume Production in Early 2020". Anandtech.com.
  211. eTeknix.com (5 February 2018). "TSMC Starts Building Fab 18 for 5nm Production - eTeknix".
  212. "TSMC to Build World's First 3 nm Fab in Taiwan".
  213. eTeknix.com (3 October 2017). "TSMC Wants to Build a 3 nm Fab in Taiwan - eTeknix".
  214. "TSMC to Build 3nm Fab in Tainan Science Park". Tsmc.com.
  215. "TSMC says 3nm plant could cost it more than $20bn". Theinquirer.net. Retrieved 2017-12-17.
  216. "TSMC Plans New Fab for 3nm". EE Times. Retrieved 2018-07-20.
  217. News, Taiwan. "TSMC might relocate NT$500B next-gen chip fab to U.S. | Taiwan News". Retrieved 2017-12-17.
  218. "TSMC Ready to Spend $20 Billion on its Most Advanced Chip Plant".
  219. Sohail, Omar (10 October 2017). "TSMC Is Investing in a $20 Billion Facility Just So It Can Continue Being Apple's Chief Supplier".
  220. "Epistar- Solutions for LED lighting, LED Applications, Co-activation service". www.epistar.com.tw.
  221. Editorial, Reuters. "UPDATE 1-Taiwan's TSMC exits LED lighting business with $26 mln..."
  222. "Taiwan Semiconductor Manufacturing Company Limited". tsmc.com.
  223. "TSMC looks at solid state lighting market". EE Times. Retrieved 2018-07-20.
  225. "Bosch beginnt Bau neuer 300-mm-Fab in Dresden". 25 April 2018.
  226. "Bosch open to making MEMS for others". 19 September 2016.
  227. Chieh, Hang Chang; Seng, Low Teck; Raj, Thampuran (2016-03-07). The Singapore Research Story. p. 120. ISBN 9789814641289. Retrieved 2017-03-22.
  228. "Analog/Mixed-Signal Semiconductor Foundry: Germany (Headquarters) single". Xfab.com. Retrieved 2017-03-22.
  229. "Analog/Mixed-Signal Semiconductor Foundry: Germany (Dresden) single". Xfab.com. Retrieved 2017-03-22.
  230. "Analog/Mixed-Signal Semiconductor Foundry: Germany (Itzehoe) single". Xfab.com. Retrieved 2017-03-22.
  231. "Malaysian start-up signs wafer-processing agreement with Sharp". EE Times. Retrieved 2018-07-20.
  232. "X-Fab set to buy Malaysia's 1st Silicon". EE Times. Retrieved 2018-07-20.
  233. "Analog/Mixed-Signal Semiconductor Foundry: Malaysia single". Xfab.com. Retrieved 2017-03-22.
  234. "Analog/Mixed-Signal Semiconductor Foundry: USA (Texas) single". Xfab.com. Retrieved 2017-03-22.
  235. "X-Fab to Swallow Altis Semiconductor". EE Times. Retrieved 2018-07-20.
  236. Website, IXYS. "Global Operations". ixys.com.
  237. "Samsung Electronics Begins Mass Production at New EUV Manufacturing Line". news.samsung.com. Retrieved 2020-02-21.
  238. "Man ufacturing". Samsung. Retrieved 2017-08-10.
  239. "Samsung Electronics Begins Mass Production at New Semiconductor Plant in Pyeongtaek, South Korea". news.samsung.com.
  240. "Samsung Is Investing $18 Billion in Memory Chip Production". Fortune. Retrieved 2018-02-17.
  241. "Man ufacturing". Samsung. Retrieved 2017-06-22.
  242. "Samsung to Invest More than $1 Billion in Texas Factory".
  243. "Samsung Breaks Ground on $14 Billion Fab". EE Times. Retrieved 2018-07-20.
  244. "Samsung Opens Largest Wafer Plant In Austin. Texas | Samsung Semiconductor Global Website". www.samsung.com.
  245. "Manufacturing". Samsung. Retrieved 2017-08-22.
  246. "Error - 시스템 내부 오류 안내". Secc.co.kr.
  247. "Samsung Electronics Launches Second-Phase Investment Strategy for Hwaseong Semiconductor Plant".
  248. "About us - Our Business Overview - Samsung Semiconductor - Samsung Semiconductor Global Website". Samsung.com.
  249. Shilov, Anton. "Samsung's Multi-Billion Fab in Pyeongtaek Starts Production of 64-Layer V-NAND".
  250. Lee, Se Young. "Samsung Electronics makes $14.7 billion bet with new South Korean..."
  251. "Samsung investing $14.7 billion in new chip fabrication facility".
  252. "Summer of Samsung: A Corruption Scandal, a Political Firestorm—and a Record Profit".
  253. Shilov, Anton. "Samsung Preps to Build Another Multi-Billion Dollar Memory Fab Near Pyeongtaek".
  254. www.etnews.com. "Samsung to Start Constructing Its Second Semiconductor Plant in Pyeongtaek".
  255. Shilov, Anton. "Samsung's Multi-Billion Fab in Pyeongtaek Starts Production of 64-Layer V-NAND".
  256. Editorial, Reuters. "Samsung to begin investing in new domestic memory chip line: Yonhap".
  257. "Samsung Is Nearly Finished Building World's Largest Factory - Androidheadlines.com". 12 April 2017.
  258. "About Samsung Foundry ㅣ SAMSUNG FOUNDRY". www.samsungfoundry.com.
  259. "Location of Our Offices". Samsung. Retrieved 2017-08-22.
  260. "Samsung to spend $7 billion on wafer fab in Xian, China". EE Times. 2012-04-03. Retrieved 2017-06-22.
  261. "Samsung Puts 3D NAND Production Line in Xi'an into Full Operation". BusinessKorea. 2015-12-21. Retrieved 2017-06-22.
  262. "Archived copy". Archived from the original on 2017-09-10. Retrieved 2017-09-09.CS1 maint: archived copy as title (link)
  263. "Seagate Technology Wafer Processing | Minneapolis | Mortenson". www.mortenson.com. Retrieved 2018-02-20.
  264. "Seagate Technology Recording Head Wafer Fab Facility | International Projects | Mortenson". www.mortenson.com. Retrieved 2018-02-20.
  265. "Seagate's Supply Chain Excellence Recognized | Seagate". Seagate.com (in Spanish). Retrieved 2018-02-20.
  266. "Where Do Hard Drive Heads Come From?". archive.is. 2018-02-20. Archived from the original on 2018-02-20. Retrieved 2018-02-20.
  267. "Where Do Hard Drive Heads Come From?". Tom's Hardware. 2008-11-20. Retrieved 2018-02-20.
  268. "Contact Us". www.broadcom.com.
  269. "Cree Careers - Cree, Inc". careers-cree.icims.com. Archived from the original on 2017-09-10. Retrieved 2018-07-17.
  270. "Cree Careers - Cree, Inc". careers-cree.icims.com. Archived from the original on 2017-09-10. Retrieved 2017-09-10.
  271. "Newport Wafer Fab are the world's first CS & Silicon foundry". www.newportwaferfab.co.uk.
  272. "Fast and agile semiconductor production at Newport Wafer Fab". www.newportwaferfab.co.uk.
  273. "Newport Wafer Fab power technologies". www.newportwaferfab.co.uk.
  274. "ChangXin Emerging as China's First DRAM Maker". December 5, 2019.
  275. "Infineon Technologies Austria AG" (PDF). Infineon.com. Retrieved 2017-03-22.
  276. (PDF). December 1, 2017 https://web.archive.org/web/20171201035808/https://www.infineon.com/dgdl/IFD_Fact-Sheet_EN_2016-09_web.pdf?fileId=5546d46159d9a237015a17d9baa001ee. Archived from the original (PDF) on December 1, 2017. Missing or empty |title= (help)
  277. "Infineon Technologies Dresden" (PDF). Infineon.com. Retrieved 2017-03-22.
  278. "Our Locations - Infineon Technologies". Infineon.com. Retrieved 2017-03-22.
  279. "Infineon launches Kulim fab". EE Times. Retrieved 2017-03-22.
  280. "Infineon Technologies Eckdaten Regensburg" (PDF). Infineon.com. Retrieved 2017-03-22.
  281. AG, Infineon Technologies. "Our Locations - Infineon Technologies". Infineon.com. Retrieved 2017-11-27.
  282. AG, Infineon Technologies. "Our Locations - Infineon Technologies". Infineon.com. Retrieved 2018-02-08.
  283. "Introduction to the D-Wave Quantum Hardware - D-Wave Systems". Dwavesys.com.
  284. "Meet D-Wave - D-Wave Systems". Dwavesys.com.
  285. "Archived copy". Archived from the original on 2015-05-02. Retrieved 2015-05-14.CS1 maint: archived copy as title (link)
  286. https://www.bizjournals.com/albany/news/2019/04/23/globalfoundries-on-semi-east-fishkill-analysts.html
  287. https://www.globalfoundries.com/news-events/press-releases/globalfoundries-acquire-land-malta-ny-positioning-its-advanced
  288. "Fab 8 Overview". 3 May 2015. Archived from the original on 2015-05-03. Retrieved 17 July 2018.
  289. "ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility". GLOBALFOUNDRIES. April 22, 2019.
  290. Anderson, Eric (April 22, 2019). "GlobalFoundries selling East Fishkill plant". Times Union.
  291. "Inside IBM's 300mm chip fab: Photos". ZDNet.
  292. "300mm Wafer Fabrication". 25 December 2010. Archived from the original on 2010-12-25.
  293. "200mm Wafer Fabrication". 25 December 2010. Archived from the original on 2010-12-25.
  294. title="Skorpios Technologies Announces Acquisition of Novati Technologies LLC" https://www.skorpiosinc.com/company/fab/
  295. "An ITW company supporting your photonics needs worldwide. With the acquisition of International Radiation Detectors (IRD) in 2011 and the merger of Cal Sensors (CSI) in 2014". optodiode.com. Retrieved 2018-01-25.
  296. "Infinera Wafer Fab Operator (Temp) Job in Sunnyvale, CA | Glassdoor". www.glassdoor.com. Archived from the original on 2018-02-20. Retrieved 2018-02-20.
  297. "Vacature voor een functie als Wafer Fab Operator (Temp) bij Infinera …". archive.is. 2018-02-20. Archived from the original on 2018-02-20. Retrieved 2018-02-20.
  298. "Rigetti Launches Full-Stack Quantum Computing Service and Quantum IC Fab". IEEE Spectrum: Technology, Engineering, and Science News.
  299. "The Quantum Computer Factory That's Taking on Google and IBM". Wired.
  300. "Rigetti Computing Named to MIT Technology Review's Annual 50 Smartest Companies List". Prnewswire.com.
  301. "NHanced Semiconductors".
  302. "Polar Semiconductor, Inc - A Sanken Company". Polarsemi.com. Retrieved 2017-03-22.
  303. "450mm Wafer Services Now Offered by Silicon Valley Specialty Foundry Noel Technologies - SEMI.ORG". www.semi.org.
  304. "Facilities at Noel Technologies for Process Development and Fabrication". www.noeltech.com.
  305. "Advanced Lithography Foundry Services -Noel Technologies CA". www.noeltech.com. Archived from the original on 2017-09-25. Retrieved 2017-09-25.
  306. "Soraa Inc. Fab Process Technician Job in Fremont, CA | Glassdoor". www.glassdoor.com. Archived from the original on 2018-02-20. Retrieved 2018-02-20.
  307. "Vacature voor een functie als Fab Process Technician bij Soraa Inc. i…". archive.is. 2018-02-20. Archived from the original on 2018-02-20. Retrieved 2018-02-20.
  308. "Mirrorcle Technologies moves into new HQ as a result of steady growth". www.cleanroomtechnology.com.
  309. "Archived copy". Archived from the original on 2014-01-19. Retrieved 2014-01-17.CS1 maint: archived copy as title (link)
  310. Luciana Magalhaes. "Corporación América Buying Batista's Stake in SIX: Argentine Firm Buying 33% Stake in SIX Semicondutores". The Wall Street Journal.
  311. SUBKARMA. "Who We Are-OPTOTECH". www.opto.com.tw.
  312. "Creative Sensor Inc. - Worldwide Sites". www.csi-sensor.com.tw.
  313. "Factory & Headquarters, Nanchang Creative Sensor Technology". www.jjpan.com.
  314. "Headquarters Phase I, VisEra Technologies Co., Ltd". www.jjpan.com.
  315. "ProMOS Goes for 70nm DRAM". SOFTPEDIA. 2007-08-13. Retrieved 2011-05-27.
  316. "Record fab construction reached in second quarter, says report". EE Times. 2004-07-02. Retrieved 2011-05-31.
  317. "Macronix - Company Overview". Macronix.com.
  318. "Our Mission | Nanosystem Fabrication Facility, HKUST". www.nff.ust.hk. Retrieved 2018-01-26.
  319. "ASMC". Asmcs.com. 2005-12-31. Retrieved 2017-03-22.
  320. "Shanghai Belling Co,Ltd". Belling.com.cn. Archived from the original on 2017-04-13. Retrieved 2017-03-22.
  321. "Company Profile -深爱半导体股份有限公司". Sisemi.com.cn. Archived from the original on 2018-07-20. Retrieved 2018-07-20.
  322. "Company History -深爱半导体股份有限公司". Sisemi.com.cn. Archived from the original on 18 July 2018. Retrieved 17 July 2018.
  323. "CSMC-About". Csmc.com.cn. Retrieved 2017-03-22.
  324. "CSMC-About". Csmc.com.cn. Retrieved 2018-07-20.
  325. "Shanghai Huali Microelectronics Corporation--About Us". Hlmc.cn. Archived from the original on 2017-09-14. Retrieved 2017-09-13.
  326. "Shanghai Huali Microelectronics Corporation--About Us". Hlmc.cn. Archived from the original on 2017-09-14. Retrieved 2017-09-13.
  327. 万户网络. "合肥晶合集成电路有限公司". Nexchip.com.cn (in Chinese). Archived from the original on 2018-02-13. Retrieved 2018-02-12.
  328. 万户网络. "合肥晶合集成电路有限公司". Nexchip.com.cn (in Chinese). Archived from the original on 2018-07-02. Retrieved 2018-07-03.
  329. "Xiamen Sanan Integrated Circuit Co., Ltd". www.sanan-ic.com.
  330. "Technology Overview" (PDF). Huahonggrace.comInfineon.com. Retrieved 2017-03-22.
  331. "厂容厂貌 - 湘能华磊光电股份有限公司". www.ledcz.com. Archived from the original on 2018-02-08. Retrieved 2018-02-08.
  332. "About Us - CanSemi Official Website". www.cansemitech.com.
  333. "IDM or foundry: CanSemi builds on analog, MCU strategy | eeNews Analog". www.eenewsanalog.com. 27 July 2018.
  334. "Pyongyang University and NK: Just Do IT!". 1 November 2010.
  335. "Kodenshi". www.kodenshiauk.com. Archived from the original on 2017-09-25. Retrieved 2017-09-25.
  336. "Worldwide Locations - ABLIC Inc. (formerly SII Semiconductor Corp.)".
  337. "About Epson Semiconductor Network". global.epson.com.
  338. "Locations in Japan : Worldwide Office Locations : OLYMPUS". Olympus-global.com.
  339. "Olympus". Semiconductor Technology. Retrieved 2018-07-20.
  340. "Olympus Corp. Places Order with Ultratech for NanoTech 160 Lithography System For Japan's First MEMS Foundry (NASDAQ:UTEK)". ir.ultratech.com. Archived from the original on 2018-01-26. Retrieved 2018-01-25.
  341. "Japan - Network - SHINDENGEN ELECTRIC MFG.CO.,LTD". SHINDENGEN ELECTRIC MFG.CO.,LTD.
  342. "Operation Sites - Company Profile - New Japan Radio(New JRC)". Njr.com. Archived from the original on 2017-09-18. Retrieved 2017-09-18.
  343. "Kawagoe Works Google Map - Operation Sites - Company Profile - New Japan Radio(New JRC)". Njr.com. Archived from the original on 2017-09-18. Retrieved 2017-09-18.
  344. "Foundry Service - Products - New Japan Radio(New JRC)". Njr.com.
  345. "New JRC Group Companies - Company Profile - New Japan Radio(New JRC)". Njr.com. Archived from the original on 2017-09-18. Retrieved 2017-09-18.
  346. "SAW Foundry - Products - New Japan Radio(New JRC)". Njr.com.
  347. "株式会社エヌ・ジェイ・アール福岡 - 会社概要". Njrf.co.jp.
  348. "Nisshinbo Group Companies - Company Profile - New Japan Radio(New JRC)". Njr.com. Archived from the original on 2017-09-18. Retrieved 2017-09-18.
  349. "Plants and Sales Office Locations/NICHIA CORPORATION". www.nichia.co.jp.
  350. "Locations - Elmos Semiconductor AG". www.elmos.com.
  351. "Welcome to UMS - MMICs Solutions for III-V Products, Support & Foundry Services". www.ums-gaas.com. Archived from the original on 2018-02-13. Retrieved 2018-02-12.
  352. "Foundry - Ion Beam Services". Ion Beam Services (in French). Retrieved 2018-01-25.
  353. "Manufacture Facilities WITH Static with lab pic HEADER".
  354. "Contact | CST Global". Contact | CST Global. Retrieved 2019-05-26.
  355. "Vsp-mikron". Vsp-mikron. Retrieved 2017-03-22.
  356. "Manufacturing at TowerJazz". Towerjazz.com. Retrieved 2017-03-22.
  357. "TowerJazz and Tacoma Announce a Partnership for a New 8-inch Fabrication Facility in Nanjing, China". 21 August 2017.
  358. "Tower confirms Chinese fab project". 21 August 2017.
  359. Intermediate People's Court of Nanjing City, Jiangsu Province. "Announcement". ACPPRC. Archived from the original on 1 October 2020. Retrieved 1 October 2020.
  360. "China's Jinhua Set to Move into DRAM Market by Building Production Plant". 2016-07-19. Retrieved 2018-02-12.
  361. "About us,Jin Hua Integrated Circuit Co., Ltd.,Jin Hua Integrated". en.jhicc.cn. Archived from the original on 8 July 2018. Retrieved 17 July 2018.
  362. "China's DRAM endeavor continues despite US sanctions". THE ELEC, Korea Electronics Industry Media. June 26, 2019.
  363. Cimpanu, Catalin. "US bans exports to Chinese DRAM maker citing national security risk". ZDNet.
  364. "Chinese foundry HSMC gearing up for 14nm, 7nm chip production". DIGITIMES.
  365. "Hynix will close 200mm fab in Oregon | EE Times". EETimes. Retrieved 2017-06-20.
  366. "Instalarán fábrica de semiconductores". Panamá América. October 4, 2008.
  367. "SemiWiki.com - A Brief History of the Fabless Semiconductor Industry". www.semiwiki.com. Retrieved 2018-02-08.
  368. "Toshiba : Press Releases 8 August, 2001". www.toshiba.co.jp.
  369. "NEC to close Livingston fab". EE Times. Retrieved 2018-07-20.
  370. "Lfoundry continues based on Rousset fab". EE Times. 1999-02-22. Retrieved 2017-03-22.
  371. Peter Clarke (2014-01-02). "Lfoundry Rousset fab closes with loss of 600 jobs". Electronics EETimes. Archived from the original on 2016-09-23. Retrieved 2017-03-22.
  372. Peter Clarke (2014-01-02). "Lfoundry Rousset fab closes with loss of 600 jobs". Electronics EETimes. Archived from the original on 2016-09-23. Retrieved 2017-03-22.
  373. "QTS Plans Huge Virginia Data Center". 5 April 2010.
  374. "NXP Semiconductors | Automotive, Security, IoT". Freescale.com. Retrieved 2017-03-22.
  375. "Freescale closes French fab". EE Times. Retrieved 2017-03-22.
  376. "NXP Semiconductors | Automotive, Security, IoT". Freescale.com. Retrieved 2017-03-22.
  377. "Agere to lay off 4,000 workers, close fab in Spain in massive restructuring of units". EE Times. 2001-06-29. Retrieved 2019-06-18.
  378. "La fábrica de Lucent de Tres Cantos dejará de producir a finales de año" [Lucent's Fab in Tres Cantos will cease production at the end of this year]. El Mundo (in Spanish). 2001-06-29. Retrieved 2019-06-18.
  379. "AT&T y Tres Cantos" [AT&T and Tres Cantos]. El País (in Spanish). 1997-12-17. Retrieved 2019-06-18.
  380. OSRTI, US EPA. "Search Superfund Site Information". cumulis.epa.gov.
  381. Harry, Stevens. "Fairchild Semiconductor to close Utah facility amid job cuts". The Salt Lake Tribune. Retrieved October 17, 2016.
  382. "Texas Instruments News Center - News Releases". Newscenter.ti.com. Archived from the original on 2015-09-06. Retrieved 2017-03-22.
  383. "MEMS wafer fab contents for sale: $5 million ONO". 25 January 2017.
  384. "Diodes to acquire FabTech, 5-inch wafer fab in Missouri". EETimes. October 30, 2000.
  385. GmbH, finanzen net. "Diodes To Cease Operations At Lee's Summit Wafer Fab In Q3 - Quick Facts | Markets Insider". markets.businessinsider.com.
  386. "Qorvo Foundry Services - Qorvo". www.qorvo.com.
  387. Mozur, Paul (2017-02-10). "Plan for $10 Billion Chip Plant Shows China's Growing Pull". The New York Times. ISSN 0362-4331. Retrieved 2018-02-12.
This article is issued from Wikipedia. The text is licensed under Creative Commons - Attribution - Sharealike. Additional terms may apply for the media files.